chips

There is a great threat to the US if you send thousands of advanced chips from AI to the Middle East. That end in China

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These days we have seen how Donald Trump has reached a series of unique agreements with countries in the Middle East. In them the protagonists are the advanced chips of AI that the US will export to Saudi Arabia or United Arab Emirates. The problem is who will really use those chips. Data centers in the desert. These countries announced projects for the construction of large data centers, although It is not too clear that they can complete them or that their dimension is what they promise. Even so, the agreements are very significant and promise the sale of thousands of Nvidia or AMD chips that will end up arriving in the countries of the Middle East. Internal doubts. As they point out in Bloomberg, some members of the Donald Trump administration are trying to slow these agreements. In the opinion of these politicians, the United States has not imposed enough barriers to prevent these chips from ending where they should not. China. According to that newspaper, agreements include clauses that theoretically They prohibit China You can access these chips through countries in the Middle East. However, US government officials believe that there have been too many details without closing and that the agreements should not be announced without being totally defined in that and the rest of the senses. Middle Chinese relationships. The company that leads in AI in the United Arab Emirates is G42, and the problem is that this company has historical ties with Huawei. It is true that it ended theoretically cutting those ties To get close to US companies much morebut there are suspicions by some US government officials about whether there is still a relationship with China. And there are other risks. Trump’s policies were supposed to reserve the vast majority of these most advanced AI chips for this country, but this agreement raises a danger: that Middle East nations have access to toe technology would give them an important competitive advantage. But better to make the agreements than them. Sources close to the situation reveal that if the US does not reach these agreements, those countries – and others in the future – could reach those same agreements with China. The Asian giant has been advancing in the development of AI chips, and although it still cannot compete with those of the US, its proposals They are increasingly promising. A strategic issue. David Sacks, advisor to AI for the White House, is the one who defends that argument the most. That would allow to avoid or at least mitigate the phenomenon of “shrinking” of the US advantage over China in advanced chips. It is something that Jensen Huang has spokenCEO of Nvidia, who believes that with all the measures to prevent China from having access to those chips what has ended up causing is that this giant activates its machinery to get rid of the dependence he had of the US. The great winner. Meanwhile, the truth is that Nvidia will be one of the great beneficiaries of the agreement, because it has closed an agreement with Saudi Arabia valued at $ 7,000 million. The impact on Nvidia’s shares has been immediate: the company’s stock market capitalization grew by 12,000 million dollars in a single afternoon. Image | The White House In Xataka | The United States prevents Huawei from manufacturing more Windows PCs. Your answer: launch your first laptop with Linux

He does not want me to sell his chips for the most advanced outside of China

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The US Department of Commerce has taken a very important step forward in his offensive against Huawei’s business outside China. During the last weeks this Chinese company has presented two chips for artificial intelligence (AI), the Ascend 910d and the Ascend 920with those who pursue occupy the holes in the Chinese market that presumably will leave Nvidia as a result of the latest sanctions to China deployed by the US. The American company led by Jensen Huang can no longer deliver to its Chinese clients Your H20 GPUand, precisely, Huawei aspires to get that market portion with its new chip ascend 920. The other GPU, the Ascend 910D chip, presumably delivers a performance comparable to that of the GPU NVIDIA H100so it aspires to consolidate as a solid alternative to the latter. The US cannot control the presence of Huawei in China, but has taken a very important step forward to cut off its presence outside its country of origin. The US is using the most powerful tool you have: its patents Frequently some readers ask us why the US has the power to prevent Asml, which is a company of the Netherlands, to sell its most advanced lithography teams to its Chinese clients. This right lies on a fundamental principle: the most advanced machines produced by ASML, such as its equipment of extreme ultraviolet photolithography (UVE) or deep ultraviolet (UVP) use US technologies. One of the most important is the innovation that allows these machines to generate ultraviolet radiation with adequate wavelength. According to the Department of Commerce, Huawei has produced these chips illegally using US technologies This is in essence the same principle that the US Department of Commerce has appealed to approve a resolution by which no country on the planet You can buy the GPU for the Ascend de Huawei. According to this American institution, this Chinese company has produced these chips using US technologies illegally, so its export outside the country borders governed by Xi Jinping violates the export controls of the Department of Commerce. In practice, the US will cost the commercial flow of the GPUs for Huawei out of China, especially when these semiconductors go to allies of the latter country. Its strategy to exert pressure on countries interested in getting the Huawei chips is to announce fines, the possibility of revoking export rights, and even establishing criminal consequences. However, the Department of Commerce has not banned the circulation outside of China of All GPUs for Huawei. The chips ascend 910b, 910c and the imminent 910d are prohibited, but the ascend 910 that TSMC produced Legally for Huawei in 2019 and 2020 it can circulate on the planet with freedom. Image | Huawei More information | US Department of Commerce In Xataka | In a low voice, China has begun to remove some tariffs from US products. Your concern: the chips

Samsung’s survival in the chips industry is in the hands of its 2 nm technology

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2025 will be the year of 2 Nm semiconductor. The three largest manufacturers of integrated circuits, TSMC, Intel and Samsung, will start the mass manufacture of these chips before the end of this year, but The starting position Of these three companies it is very different. Taiwanese TSMC leads the semiconductor production market with A fee close to 60%has a well -assorted and stable client portfolio, and Your accounts are enviable. Intel and Samsung, however, are in a much more compromised position. The American company currently led by Lip Bu-Tan is trying overcome a very bad economic streak reducing their expenses and developing its technology with the purpose of increasing its competitiveness. Samsung, meanwhile, is also going through a complicated stage, as we are about to check. In any case, for these last two companies Its 2 nm technology It is his real lifeguard. Good news for Samsung: has reached a 50% wafer performance in 2 Nm These statements made in the middle of last March by Han Jong-Hee, Samsung general co-director, They diagnose with precision What is happening to this company: “First of all I sorry for the fact that the performance of our actions has not met their expectations. In the last year our company has not correctly responded to the semiconductor market for artificial intelligence (AI), which quickly evolves. “ “Our technological advantage has been compromised in all our businesses. It is difficult to see that efforts are being made to boost great innovations or assume new challenges” This Mea guilt It is aimed at the company’s shareholders and expresses that the directive dome recognizes not having made the right decisions in recent years. “Our technological advantage has been compromised in all our businesses. It is difficult to see that efforts are being made to Promote great innovations or assume new challenges. There are only attempts to maintain the status quo instead of generating disruptive changes “, Pray an internal statement Written by Jay Y. Lee, the president of the company. However, this is not all. Samsung has led for more than three decades the industry of integrated dram memory circuit LEADS THE HBM Chips Market so much (High Bandwidth Memory) that work side by side with the GPUs for the The one of the DRAM memories. In current circumstances it is evident that Samsung needs to trace as soon as possible. And it seems that it is in it. At the beginning of 2025 several South Korean media anticipated that Large scale manufacturing of 2 nm chips It had already begun In the company’s South Korean plants. However, this does not mean that Samsung already has everything tied. Chips manufacturers need the candle performance of their avant -garde nodes is at least 70%and, according to the South Korean newspaper Munhwa Ilbothis company currently moves in the range of 40 to 50%. There are still more than seven months to finish 2025, and presumably Intel and TSMC still do not produce integrated circuits in a massive way Your nodes 18a and n2 respectively, so in theory Samsung carries a positive inertia. We will see what happens finally, but there is no doubt that this year we will bring us strong emotions in the scope of the semiconductor industry. Image | Samsung More information | Munhwa Ilbo In Xataka | This is the chips war: a former SK Hynix employee is suspected to deliver stolen technology to Huawei

China’s big problem with chips is its difficulty to go beyond 7 Nm. Huawei’s new megaphabic confirms it

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China is doing everything in your hand to achieve total independence of its semiconductor industry. The commercial and technological war that sustains with the US prevents the country of Xi Jinping access to the manufacturing equipment of Most advanced integrated circuits that produces The Dutch Company ASML. And this in practice does not allow Chinese manufacturers, such as SMIC or Hua Hong Semiconductor, produce integrated avant -garde circuits easily. In the previous paragraph I have used the adverb “easily” intentionally because, in reality, China is manufacturing avant -garde semiconductors. They are doing it At least SMIC and Huawei using, as we have explained in other articles, a lithography technique known as Multiple patterning. This strategy in broad strokes consists in transferring the pattern to the wafer in several passes with the purpose of increasing the resolution of the lithographic process. His problem is that he usually has an upward impact on the cost of chips and the decline in production capacity, although it works. In fact, the most advanced chips we can find in the last smartphones and hardware for artificial intelligence (IA) more sophisticated in Huawei have been manufactured using the technique of Multiple patterning with the purpose of reaching 7 Nm. However, presumably this Chinese company will produce Your new GPU for the Ascend 920 During the second half of 2025 using 6 Nm integration technology. Satellite images show the huge complex that Huawei is building A little over a year ago, in February 2024, the newspaper Financial Times said having had access to the statements of two experts who defended that SMIC was finalizing the refinement of their semiconductor manufacturing processes in their deep ultraviolet machines (UVP). Its purpose, according to this source, was to have the necessary technology to manufacture Integrated 5 nm circuits Massively before the year 2024. For SMIC and its clients, among which Huawei is, this would be a very important achievement. Huawei is trying to develop its own integration technology to go beyond 6 and 7 nm However, Huawei’s 5 NM socates have not yet appeared. The chip Kirin 9010 which has happened to the 9000S model is also being manufactured in the 7 NM SMIC node using The technique of Multiple patterning. We can find this soc, for example, in the new triple folding of Huawei, the Mate XT Ultimate Designwhich we tried during the latest edition of the Mobile World Congress in Barcelona. Anyway, we can be sure that Huawei is trying to develop its own integration technology to go beyond 6 and 7 nm. In addition, it has the support of the Chinese government. In fact, Financial Times He has achieved photographs taken from a satellite in which it is possible to see a titanic manufacturing complex of integrated avant -garde circuits that Huawei is building in Shenzhen. It is meritorious that a single company is trying to develop all the links in the semiconductor supply chain and AI, As Dylan Patel arguesthe founder of the semi -health consultant, but There is a problem. And is that according to Eleanor Olcottthe Financial Times correspondent in China expert in technology, this megaplant of chips production aspires to manufacture integrated 7 nm circuits destined for smartphones and hardware for Huawei. If this information is confirmed, it will be evident that this company is still anchored at 7 Nm, although it is important that we do not overlook that this semiconductor production plant will presumably belong to Huawei. Until now, its 7 Nm chips were manufactured by SMIC, but it seems that in a short time this company will have the ability to produce its own avant -garde circuits. It is only a matter of time that finally the barrier of the 6 and 7 nm is shot down. Image | Huawei More information | Financial Times In Xataka | TSMC acknowledges that it has been considered taking its factories out of Taiwan. It is impossible for a good reason

China’s future in the chips industry is in the hands of a single company almost unknown: Sicarrier

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Sicarrier is not a Chinese company. When we repair the country’s semiconductor industry led by Xi Jinping probably many of us think of companies like Huawei, SMICHua Hong semiconductor or Naura Technologyamong others. But not in Sicarrier. Until just a few weeks this company It was a real unknown Beyond China’s borders, but in a record time it has attracted the attention of the global industry of integrated circuits. And he has done it for a weight reason: it is the authentic responsible for China currently having the ability to produce avant -garde chips. Although it was founded in 2021, during the last four years Sicarrier has maintained a very low profile. Its origin is not entirely clear, but The most reliable sources They collect that this company is probably a huawei split. What we know for sure is that it is a state company administered by the Shenzhen government. Sicarrier’s soul are veteran engineers of ASML and Applyed Materials I will not prolong the mystery more: Sicarrier is dedicated to designing and manufacturing photolithography equipment and wafering processing machines. In fact, the more than 30 products that it has presented just a few weeks ago in SemiCon China 2025 competes with the solutions of the Dutch company ASMLthe Japanese Tokyo Electron or the American Apply materials. It is shocking that a company with just four years already has proposals capable of competing in the market of chips manufacturing equipment. But it seems to have earned it. Whatever this presumable success is not the result of chance. And is that his main team is led by engineers with more than two decades of experience in the ranks of ASML and Applyed Materials. In fact, these technicians are surely responsible for the milestone for which Sicarrier is probably in the spotlight of the US administration: the technology used by Huawei and SMIC for MANUFACT 7 NM INTEGRATED CIRCUITS derives from a patent that seeks to make the production of 5 Nm chips possible using equipment from deep ultraviolet lithography (UVP). The technology used by Huawei and SMIC to make 7 Nm chips derives from a patent from Sicarrier The most ambicious lithography equipment by Chinese integrated circuit manufacturers is the extreme ultraviolet lithography machine (UVE). ASML is the only company that produces them, but THE SANCTIONS TO CHINA DE USA They prevent you from giving it to your Chinese clients. The problem is that this equipment is necessary to produce on a large scale and with a competitive price semiconductors of 7 Nm or with even more advanced integration technologies. Sicarrier has not presented a UVE photolithography team in China 2025. It is very unlikely to have it, but, at the same time, it is reasonable to anticipate that their engineers will be working on a machine of these characteristics. The teams that this company has already made known, or, at least, has officialized, are A 28 Nm immersion lithography machinean engraving equipment for advanced nodes below 7 Nm, diffusion machines for rapid thermal processing, chemical vapor deposition equipment for nodes of 28 to 5 Nm, verification machines and test for advanced integrated circuits, etc. The retahíla of lithography and wafering processing that Sicarrier has presented in Semi -Con China 2025 is long. As I mentioned a few lines above, these products compete with the proposals of ASML, Applied Materials or Tokyo Electron, although the authentic Sicarrier fire test will be the tuning of a UVE lithography machine. Du liqun, the president of this company, has declared that its strategy requires betting on the development of avant -garde lithography equipment, selective deposition machines and latest generation transist technologieslike ga (Gate-alall-around), which is already part of the Porfolio of TSMC, Intel and Samsung. It is still early to identify if Sicarrier will live up to the expectations it has generated, but there is no doubt: there is a new actor in the integrated circuit industry. And it is worth following the track very closely. Image | Sicarrier More information | Nomad semi In Xataka | This is China’s big problem with chips: Huawei will manufacture its Kirin X90 for PC using the 7 Nm of SMIC

The European Chips Law will fail. The European Court of Accounts believes that it is very unlikely to succeed

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On February 8, 2022 Ursula von der Leyen, the president of the European Commission, announced that the old continent wants to be a fundamental actor in The semiconductor industryand the first step to achieve it requires manufacturing 20% of the planet chips in 2030. The CHIPS ACT Directive mobilizes up to 43,000 million euros between public and private investment to make it possible, and the still little tangible Integrated circuit plants that Intel and TSMC have programmed on German soil are two key pieces on this itinerary. Despite its similarities, the US plan paints better than that of Europe. The country led by Donald Trump has an integrated circuit manufacturing infrastructure more solid than that of the old continent. In addition, Intel, TSMCSamsung, Texas Instruments and Globalfoundries are some of the companies that are already putting new avant -garde plants on American soil. And the US government seems to be determined to invest all the money that is needed to achieve the leadership position to which it aspires. The Court of Accounts report gives Europe a reality bathroom Europe needs to be ambitious if it wants to increase its relevance in the semiconductor industry. Have Asml and Intel facilities, Globalfoundries, and presumably in the future also of TSMC, within its borders he plays in his favor. However, the speech of European leaders, among which are Ursula von der Leyen, the president of the European Commission, and Thierry Breton, the European Commissioner of Internal Market and Services, seems to be focused on the quantity, and is not enough. The quality understood as the capacity of a chip to deliver added value is also fundamental. The automotive and appliance industry are two of those that are essentially nourished by relatively simple integrated circuits, and it is important that Europe produces them. However, it is also essential that In European soil, avant -garde chips are manufactured such as those that require, for example, data centers and research centers artificial intelligence (AI). Otherwise Europe will continue to depend on the plants located abroad to be competitive in this strategic ecosystem. “We are currently far from the pace necessary to meet our ambitions. The 20% objective was basically an aspiration” As we have anticipated in the holder of this article, the European Court of Accounts, which is nothing other than “the financial guardian” of the European Union, has published A very thorough report in which he argues that the objective of achieving a 20% share in the world market of integrated circuits in 2030 seems unattainable. And this means that “it is very unlikely that the European Union achieves its objective.” At the current situation, as we have verified in the first paragraphs of this article, this conclusion is perfectly credible. The Court of Auditors points out some interesting ideas in which we are being briefly stopped. Annemie Turtelboom, the head of this audit, He maintains that “The European Union needs a dose of reality in its strategy for the microchips sector (…) This is a field that changes rapidly, is characterized by its intense geopolitical competence, and currently We are far from the necessary rhythm To fulfill our ambitions. The 20% objective was basically an aspiration. To achieve this, our production capacity would have to be four times higher in 2030 and we are far from achieving those figures at the current speed. “ However, the production capacity they currently have and will have chips manufacturers established in Europe in Europe is not the only problem. The Court of Accounts points something that is important that we do not overlook: access to raw materials that are necessary to produce semiconductors, such as Rare earths; The cost of energy and geopolitical tensions further hinder the European Union plan. And, of course, the Chinese chips industry, Taiwan, Japan, South Korea and the US will not stop their growth, so these countries will not easily give market share. We will see what happens during the next five years, but objectively the panorama does not paint well for Europe. Image | TSMC More information | European Court of Accounts In Xataka | We already know what the chips that will arrive until 2039 will be. The machine that will manufacture them is close

It will exempt some American chips from retaliation tariffs

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On April 11, the Chinese government announced that it would apply some 125% tariffs to the products imported from the US. This measure was the expected response after the government led by Donald Trump gradually increased taxes About Chinese imports until reaching 145%. The commercial war had just entered its cruel phase, but shortly after, on April 14, the US decided to give a provisional respite to The technology industry. And it is that the Trump administration temporarily paralyzed tariffs linked to The import of semiconductorselectronic devices and some strategic components. Just a few hours ago the Xi Jinping government He has responded using the same US tone: exempting tariffs at least eight different categories of integrated circuits manufactured in the country governed by Donald Trump. Interestingly, memory chips are still in force. China has chosen to reduce tension and protect its supply chain The Chinese administration has taken approximately two weeks to approve this exemption from the moment it announced the implementation of the 125% tariffs to the products imported from the US, but has remedied it. Customs authorities have informed Chinese companies that tariffs that have paid between April 10 and 24 for semiconductors who are now exempt from taxes will be returned to them. The longevity of this measure will be linked to the decisions that the US government will make during the next weeks At the moment we do not know how long this measure will last, but in all likelihood its longevity will be linked to The decisions you will make during the next few weeks The US government. In fact, the latter has anticipated that within a period not exceeding two months will announce to which tariffs they will be subjected Imported chips. In any case, this decision has two very beneficial consequences for China. On the one hand it relieves the pressure on their own economy by allowing their companies to import without additional taxes some critical integrated circuits that at the moment do not produce the manufacturers of local semiconductors. In addition, at the current situation this strategy allows China to protect its own supply chain. If all the chips designed or manufactured in the US had a 125% tariff load the tension to which it would be subjected China’s supply chain would be hardly bearable. All probability this would trigger a critical chip shortage that would degrade the competitiveness of Chinese companies. This measure of the Xi Jinping government is clearly a tactical adjustment. It maintains the pressure on some chips from the US, but, at the same time, it avoids shortage in its internal market for essential integrated circuits. More information | SCMP In Xataka | China has a new hydrogen pump. It is so destructive that it seems nuclear

We already know what the chips that will arrive until 2039 will be. The machine that will manufacture them is close

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If everything goes as planned Intel will have its lithography 14a (1.4 Nm) List in 2026. It will be the first integration technology of this company that will use the equipment of extreme ultraviolet photolithography (UVE) and AL ASML opening. TSMC and Samsung have already confirmed that They will also bet on this machinebut for now it is Intel who carries the lead. In fact, it has been about a year and a half Testing it in its Hillsboro plant (USA). The engineers of the Dutch Company ASML have invested a decade in the development of the technology necessary to put this machine ready, which, in reality, is a high -generation extreme ultraviolet lithography team. This company of the Netherlands plans to deliver to its customers annually from 2025 about 20 teams of this type with one purpose: put in their hands the possibility of producing 2 nm chips And beyond. Much further. After the High-no lithography equipment, the Hyper-NA machines will arrive To develop the UVE Lithography team (EUV high-na for its acronym in English) ASML engineers have put a very advanced optical architecture that has an opening of 0.55 compared to the 0.33 value that the first generation UVE lithography equipment has. This refinement of the optics allows to transfer to the wafer patterns of greater resolution, hence it is possible to manufacture chips using more advanced integration technologies than those currently used in the nodes of 2 and 3 Nm. In the article we dedicate to Rayleight criteria We explain in a lot of detail what the ‘Na’ parameter consists (Numerical Aperture), But in this text it is enough for us to know that this variable identifies The opening value of the optics Used by the lithographic equipment. In this context this parameter essentially reflects the same as the opening value when we talk about The optics of a photo cameraso it conditions the amount of light that the optical elements They are able to collect. As we can intuit, the more light gathens, the better. A single UVE Machine of haute opening is capable of producing more than 200 wafers per hour However, this is not all. ASML has also improved the mechanical systems that are responsible for the manipulation of wafers with the purpose of making it possible for a single UVE Machine to be able to produce more than 200 wafers per hour. This benefit is very important for semiconductor manufacturers because it deeply conditions its competitiveness. If we want to investigate to show what is beyond the Uve haute opening teams, the ideal is that we turn to Imec, an integrated circuit research center founded in 1984 and lodged in Leuven (Belgium). It is the most experienced laboratory in the tuning of new integration technologies that we have in Europe. In fact, their engineers work side by side with ASML technicians. The slide we publish on top of these lines contains a lot of interesting information. According to IMEC in 2035 integrated circuit manufacturers will begin large -scale production of 3 angstroms chips (0.3 Nm). This milestone is very important because presumably these will be the first semiconductors made of UVE lithography equipment Hyper-na In which Asml is already working. However, of course, these machines will not arrive that year; They will be ready much earlier. That will be the time when Chips manufacturers will start large -scale production, but possibly this machine will be prepared at the end of this decade. Whatever the interesting thing is that the opening of the optics of these avant -garde lithography equipment will be, again according to IMEC, of ​​0.75 in the face of the opening of 0.55 of the UVE machines of high opening, or 0.33 in the conventional UVE equipment, as we have seen a few lines above. In any case, the itinerary of this laboratory anticipates that In 2037 the integrated circuits of 2 angstroms will arriveand in 2039 chips manufacturers will pass this barrier and go beyond the 2 angstroms. It seems science fiction, but it is not. It’s just science. Image | IMEC More information | IMEC In Xataka | China needs to develop a new type of immune chips to US sanctions. And their scientists have just achieved it

Russia plans to manufacture its own 28 Nm chips in 2030. It will continue to be light years from the US and its allies

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The relationship sustaining USA and Russia is disturbing. The interests of the administration led by Joe Biden They seemed hardly reconcilable with those of the Government of Vladimir Putin, but Donald Trump’s return to the White House The rules of the game have changed. It had been many years that the interests of Russia and the US were not as aligned as they seem to be now. At this situation it would not be strange for Trump -led administration to Advanced lithography equipment. At the moment it is only an elucubration, but in the current circumstances it is not a far -fetched possibility. Anyway Russia has a plan to reinforce your semiconductor industry and reduce their dependence on foreign technologies. In October 2024 the Ministry of Industry and Commerce announced that it will invest 2,540 million dollars until 2030 in the development of own photolithography machines that allow it to become independent of foreign powers. Within the framework of the Russian economy it is an important expense that in the medium term seeks to develop the ability to make chips of 28 nm. Russia says you are already making chips with its first UVE lithography team At the end of May Vasily Shpak, Deputy Minister of Industry and Commerce of the Russian Federation, advertisement During the conference “Industrial Russia Digital Industry” that your country already has prepared its first team of extreme ultraviolet photolithography (UVE). In addition, Shpak confirmed that its construction is entirely Russian, and, more importantly, it also anticipated that this first UVE machine is capable of manufacturing integrated circuits of 350 nm. In 2026 Russia should have a prototype of UVE equipment capable of manufacturing 130 nm chips The really important thing is that Russia apparently already has the necessary technology to tuning these photolithography machines. From here their engineers and physicists can gradually refine their technology to make possible the production of more advanced integrated circuits. In fact, it is fair What the Russian government plans to do. And its itinerary establishes that in 2026 Russia should have a prototype of UVE lithography equipment capable of manufacturing 130 nm chips. And in 2028 another similar one trained to produce integrated 7 nm circuits. However, it is important that we do not overlook that this itinerary does not describe the moment in which Russia will acquire the ability to manufacture these large -scale integrated circuits. This will be the really relevant milestone. Whatever the Russian medium COMNEWS He has collected statements from Konstantin Trushkin, the deputy director of development of the MCST CPU Design Company, in which this engineer argues that Russia will have plants capable of producing large -scale integrated circuits of 28 Nm between 2028 and 2030. This purpose is credible, but by then presumably TSMC, Intel and Samsung will already have the capacity to manufacture in a massive way 1 Nm semiconductor. More information | COMNEWS In Xataka | China needs to develop a new type of immune chips to US sanctions. And their scientists have just achieved it

It cannot guarantee that their avant -garde chips will not arrive in China

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TSMC faces a crossroads. At the current situation of tension between the US and China this Taiwanese semiconductor manufacturer, The Major on the Planethe has chosen to develop drastically Your production infrastructure In the country led by Donald Trump. This strategy will allow you dodge future tariffs which presumably will apply to the integrated circuits produced abroad. However, this is not all. In addition, having more manufacturing plants and more advanced packaging centers in the US will allow TSMC to better protect your business if in the future it is triggered A war conflict between China and Taiwan. In these circumstances it is evident that the company led by CC Wei is interested in sustaining an affable relationship with the US. However, their ties are currently committed because of the integrated circuits manufactured by TSMC that are arriving in China. TSMC has been sincere with the US This semiconductor manufacturer is subject to an investigation by the US Department of Commerce Since October 2024. The organization that then led Gina Raimondo suspected that this company could have secretly reached agreements with Huawei to take care of the manufacture of its semiconductors for smartphones and applications of artificial intelligence (AI). In December 2024 TSMC broke its commercial relationship with Powerair, a Singapore company that, apparently, was responsible for delivering to Huawei the chip manufactured by TSMC that appeared on the card for the Ascend 910b. Interestingly, this was the second company presumably responsible for getting to Huawei Integrated circuits produced by TSMC. In 2023 this last company stopped offering its manufacturing service to the Chinese Chips Design Company Sophgo to illegally mediate with Huawei. TSMC could receive a fine of one billion dollars, or even more, from the US Department of Commerce However, their problems did not end here. At the beginning of last March the CSIS (Center for Strategic and International Studies), An American organization that is dedicated to elaborating strategies that seek to guarantee the security of the US, accused TSMC having manufactured indirectly for Huawei for 2024 no less than two million chips of the Ascend 910. With these integrated circuits this Chinese company could have produced a huge amount of units of its ascend 910c solution, which is currently its hardware for the most advanced. As we explain in early April, TSMC could receive a fine of one billion dollars, or even more, of the Department of Commerce. US regulation establishes that in this context the sanction can ascend twice the value of the transactions that have violated export restrictionswhat could place this fine as one of the highest in history for this type of infraction. TSMC has recently published its last annual report and has not let out the opportunity to explain to the US Administration What is your position in this conflict: “Our role in the semiconductor supply chain inherently limits our visibility and the information we have about the final use or the end user of the products that incorporate chips manufactured by us. This limitation hinders our ability to fully guarantee that the semiconductors we produce are not diverted to an endless use or user avoid controls. ” It is likely that the US responds to this TSMC statement very soon. We will keep you aware of everything. Image | TSMC More information | TSMC In Xataka | The US tariffs are already hurting two of the companies that support Taiwan’s economy: TSMC and Foxconn

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