chip

Samsung is tired of being second in the chip race. Now they are preparing to dethrone the titan of Taiwan

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When we talk about artificial intelligence, there are several proper names that star in the conversation. NVIDIA has become the foundation and cement of AI thanks both to their products as, above all, your money. But it’s impossible to leave Samsung out of the equation. Your HBM4 memories They are the ones that will allow NVIDIA and AMD manufacture their platforms new generation, but South Koreans do not want to stop there. They seek to be the largest advanced factory in the world and have launched a plan to wipe TSMC where it hurts the most. In the expansion throughout the United States. An x8 thanks to AI. 2025 was a transition year for Samsung. While its great rival in the memoir segment –SK Hynix– dominated the HBM chip marketSamsung is preparing to make the leap with HBM4 chips. This is the new generation of high-bandwidth memory designed to power the new AI platforms from both NVIDIA and Samsung. The effort paid off by overtaking SK and becoming the supplier of the two giants, and it is something that is already materializing. At least in estimates profit, of course. Now the company forecast profits of about 38 billion dollars for the first quarter of the year, something that destroys the profits of the same period last year, being eight times more. Texas. The company does not stop manufacturing the new HBM4 memory, but even so it cannot satisfy the enormous demand of its customers and there are already those who expect that the prices of these chips will increase by more than 50%. To meet demand, Samsung is moving, and The United States is key in its ambitious expansion. The South Korean company seeks to invest 37,000 million dollars in US soil, and 17,000 million of them they will stop to the Taylor, Texas plant. According to Korea Heraldthe company is finalizing hiring for this semiconductor plant where they hope to produce cutting-edge 2-nanometer chips. It is estimated that 1,500 people will be directly employed and the idea is to produce transistors with gate-all-around architecture. TSMC in the spotlight. Recent reports indicate that Samsung has already begun producing test units of chips in that lithography with the aim of beginning mass production by 2027. But this expansion is not only occurring in the United States. At the Pyeongtaek Campus, Samsung’s operations center, building a new factory for which Samsung has just ordered 20 EUV lithography machines valued at almost $8 billion. As it could not be otherwise, they are from ASML and it is estimated that the plant will have 70 units in total to support the production of HBM4 memory chips. And these two movements have one goal in mind: to dethrone the queen of semiconductors. Currently, TSMC takes the lead with NVIDIA and Apple as its best clientsbut Samsung is another industry giant that may not take the global throne, but is aiming for something more concrete: to be the one who leads the way in the United States. Both Samsung and TSMC are in full expansion throughout the United States, but if Samsung manages to start mass manufacturing of 2nm chips by 2027, it would overtake TSMC -focused on 2/3nm chips– in that development of advanced chips in the United States. It is still a vital race, since Tesla, Apple, NVIDIA or AMD are trying to get chips manufactured in the US and thus meet the demands of Donald Trump’s government. Trojan horse. In the end, it’s a move that Samsung can only win from. On the one hand, expand its HBM4 chip capacity to power AI platforms that do not seem to stop increasing in the short term. On the other hand, continuing to settle on American soil where it maintains a battle with the Taiwanese giant. But, also, Samsung is one of the founding members of the EPIC program of Applied Materials together with SK Hynix. They are positioning themselves to be the big player in semiconductors both as a factory and when it comes to designing machines and processes that allow for shorter development times for cutting-edge chips. and all this foreign companies are doing it on US soil when what the current government wanted was for were American companies those who will take the lead. In fact, Samsung’s plans are so ambitious that they are already looking for master 1nm chip production by 2030. In Xataka | ASML has discovered a way to further improve its SVU machines. This is terrible news for China and the US.

prepares total blockade of chip manufacturing machines arriving in China

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The US has been exercising its control over advanced integrated circuit manufacturing equipment for five years now to prevent it from reaching China. It is the strategy with the one that has managed to slow downbut in no way slow down, the technological development of the country led by Xi Jinping. In 2021, it approved the first restrictions that prevented machines from extreme ultraviolet photolithography (UVE) of ASML and other advanced equipment arrive in China. From that moment on, the US Government has continued to deploy new sanctions with the purpose of increasingly limiting the access of Chinese semiconductor manufacturers to lithography and wafer processing equipment that comes not only from the US, but also from the Netherlands, Taiwan, South Korea or Japan. The US is exercising ownership of some of the patents that these machines use, and also their ability to influence the decisions made by their allies. However, the Administration led by Donald Trump still has room to tighten its siege on China. And presumably it will do so in the short term because several senators belonging to both parties (Democrats and Republicans) have proposed new legislation which seeks to impose an essentially total ban on exports of advanced chip manufacturing and wafer processing equipment to certain corporations in adversary nations. It is clear that China is in their sights. Objective: Prevent ASML’s UVP photolithography machines from reaching China State-of-the-art lithography equipment is extraordinarily complex and sophisticated. Currently, the most used by integrated circuit manufacturers to produce cutting-edge chips are deep ultraviolet (UVP) and extreme ultraviolet (UVE) machines. A priori, UVP machines are suitable for manufacturing semiconductors up to 10 nm. And with EUVs it is possible to go up to 2 nm. However, by refining the processes involved in transferring the pattern to the wafer and turning to multiple patterning It is possible to go beyond these integration technologies. The US is especially targeting SMIC, Huawei, Hua Hong Semiconductor, YMTC and CXMT This technique broadly consists of transferring the pattern to the wafer in several passes with the purpose of increasing the resolution of the lithographic process. It may have an upward impact on the cost of chips and a downward impact on production capacity, but it works. SMIC (Semiconductor Manufacturing International Corp), the largest Chinese semiconductor manufacturerhas resorted to multiple patterning for manufacture 7nm integrated circuits using ASML’s Twinscan NXT:2000i UVP lithography equipment. US export controls currently prevent the sale of UVP equipment to specific factories in China that may or may not appear on the US blacklist, but do not prohibit its sale to the companies that own these plants. This is precisely what the MATCH Law seeks to change (Multilateral Alignment of Technology Controls on Hardware) that US senators have proposed. In practice this proposal will, if successful (and it probably will), prevent ASML’s UVP machines and other advanced wafer processing equipment from reaching any facilities of major Chinese chipmakers. The US is targeting SMIC, Huawei, Hua Hong Semiconductor, YMTC and CXMT, and also their subsidiaries. He picks it up clearly. the published document by Senator Michael Baumgartner. In reality this proposal does not introduce new restrictions; what it does is change how shipping is allowed of advanced tools to prevent Chinese companies from continuing to develop sophisticated techniques, such as multiple patterningwith the purpose of producing cutting-edge chips. Be that as it may, in the medium term, China will need to have your own advanced lithography machines to be able to sustain its technological development. Image | Generated by Xataka with Gemini More information | Congressman Michael Baumgartner In Xataka | We already know what the chips that will arrive until 2039 will be like. The machine that will allow them to be manufactured is close

What is SMIC, China’s big chip manufacturer, doing right now? According to the US, sell them to Iran for the war

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The war in Iran continues. On the one hand it is said that it is almost finished, but on the other we have the shipment of thousands of American paratroopersmore calls for support and one sided offensives and from another. But in almost any conflict, not only those in the countries involved come into play, but also the allies. And the United States has leveled a pretty serious accusation against China: SMIC is selling chips to Iran. Well, “almost certainly.” SMIC in the spotlight. Semiconductor Manufacturing International Corp the great Chinese semiconductor foundry. Included in the blacklist of the United States government along with Huaweihas managed to develop advanced chips in record time. They have not only challenged everything the US thought they could dobut that association with Huawei and the country’s push for the technology industry have made it one of the spearheads of China’s technological sovereignty. That SMIC has been able to manufacture advanced chips when it was denied access to cutting-edge technology is something that upsets the US government, which reiterated the sanction and keeping the company on the blacklist for alleged ties to the Chinese government. And the latest accusations are not going to relax the tension. ANDUSA says yes. SMIC makes chips and obviously sells chips. And the United States claims that they are supplying technology to Iran. a few days ago, Reuters published an article in which it included two statements by “two senior officials in the Trump Administration” that suggested that Beijing, perhaps, is not staying as far away from the Iran war as they would have us believe. In the article they state that SMIC has been sending chip manufacturing tools to the Iranian army. This raised questions about Beijing’s stance in the conflict, with officials noting – on condition of anonymity – that the company began shipping the tools about a year ago and that they have “no reason to believe shipments have stopped.” A year ago, the United States was not at war with Iran, and China has long maintained a normal trade situation with Iran. US officials note that, in addition, “they have almost certainly also technically trained Iran on semiconductor technology.” And let’s remember that these chips are in everything: from routers to missiles. China says no. The Reuters article does not give any further information or details on whether Iranian tools that included US technology have been confiscated –something that does occur in other conflicts– and neither the Chinese embassy in Washington, SMIC or an Iranian spokesperson at the UN responded to requests for comment. Who has left Lin Jian, the spokesperson for China’s Ministry of Foreign Affairs, spoke out and did not hesitate to classify the report as “false information.” He accused certain media outlets of launching self-serving news and then classifying all reports as “false information.” On this issue, China has been caught between two waters, first condemning the assassination of Ayatollah Ali Khameini by the Israeli and US forcesbut also expressing his rejection of the Iran attacks on Gulf states that house US bases. Back in focus. Beyond Iran, the United States accusations are part of an operation that began a few years ago. The veto of Huawei marked the beginning of the current trade war between China and the United States, but it also marked China’s ‘awakening’ in technological matters, quest for sovereignty and a technological war that branched into chips, robotics, energy, communications, artificial intelligence and in the military arm. SMIC is the large Chinese manufacturer that defied US vetoes by managing to manufacture the chip of the Huawei Mate 60 Pro before whom The US authorities could not believe and, if they manage to demonstrate that they are involved in supporting Israel when China is not actively participating in the conflict, they will have more reasons to intensify the vetoes and sanctions. And all this is framed in a current situation in which Trump and Xi Jinping will meet in a few days to discuss international relations and where the purchase of American technology by China is expected to be one of the points of the day, with NVIDIA very interested in biting a piece of the $50 billion pie that the Asian giant represents. Images | Ballistic Missile, ASML In Xataka | While the US bombs Iran, something unusual has happened: drones attacking the nuclear bases in North Dakota

Lace Lithography is Europe’s opportunity to surpass the US and Asia in chip manufacturing. From Barcelona

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Lace Lithography is not just another startup. And it is not because it is developing a new photolithography technique that seeks to break down all the barriers that limit the performance of ultraviolet light technology used by the machines manufactured by the Dutch company ASML. And they are used by TSMC, Intel, Samsung, SK Hynix or SMIC, among other semiconductor manufacturers. A priori, the most prudent thing to do when faced with news like this is to adopt a skeptical stance, but Lace’s work deserves to be taken very seriously. Otherwise it would not have the support of Microsoft nor would it have raised $40 million in financing. The founders of this company are the Norwegian physicist Bodil Holst and the Spanish physicist and engineer Adrià Salvador Palau. These two scientists created Lace Lithography in 2023, and although their headquarters reside in Bergen (Norway), an important part of their research and development team operates from Barcelona. Be that as it may, the most important thing is that the strategy that this company has devised to solve the lithography of the next generation of integrated circuits does not resemble nor to ASML technology nor to any other innovation we have heard of so far. The first prototypes are already ready and the test plant will be ready in 2029 The itinerary that Lace Lithography seeks to follow is very ambitious. Its first prototypes, according to Reutersare already prepared, and intends to develop a test tool and a cutting-edge semiconductor manufacturing pilot plant in 2029. In any case, in addition to their plans, we know some details about their technology that are worth investigating. In the integrated circuit manufacturing equipment that ASML designs and produces, ultraviolet light is responsible for transporting the geometric pattern described by the mask so that it can be transferred with great precision to the surface of the silicon wafer. Lace Lithography uses a beam of helium atoms to transfer the pattern described by the chip to the silicon wafer The light used by high-aperture extreme ultraviolet lithography equipment, which is the most advanced machine that ASML has Currently, it belongs to the most energetic portion of the ultraviolet region of the electromagnetic spectrum. In fact, its wavelength extends in the range that goes from 10 to 100 nanometers (nm). The problem is that it is not easy to generate and deal with this form of electromagnetic radiation. And it is not, among other reasons, because it is so energetic that it alters the structure of the physical elements with which it interacts inside the lithography machine. Lace’s technology solves this and other problems that are closely linked to the use of ultraviolet radiation to manufacture chips. And instead of using light, the engineers at this company use a beam of helium atoms to transfer the pattern described by the chip to the silicon wafer. However, the most striking thing is that this beam has the width of a single hydrogen atom (around 0.1 nm), so on paper this solution will make it possible to produce semiconductors ten times smaller than the smallest ones that TSMC, Samsung or Intel are currently manufacturing. “Our technology opens a path that potentially has the ability to expand (chip makers’) agenda, as well as make things possible that otherwise would not have been viable,” Bodil Holst declared. John Petersen, scientific director of lithography at IMEC (Interuniversity Microelectronics Center), the most experienced laboratory in developing new integration and nanotechnology technologies that we have in Europe, maintains that the main advantage of using the helium atom beam is that it allows creating much smaller transistors than the current ones. “They are almost unimaginable,” Petersen pointed out. It sounds really good. Image | Generated by Xataka with Gemini More information | Reuters | Lace Lithography In Xataka | China needs to develop a new type of chips immune to US sanctions. And your scientists have just achieved it

Japan is advancing like a steamroller in the chip industry. It is already looking towards 1.4 nm and threatens Taiwan’s dominance

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If we stick to the field of technology, Japan has missed two very important trains that it should not have missed: the manufacturing of cutting-edge semiconductors and the development of models of artificial intelligence (AI) pointers. In its “Summary of the Strategy for the Revitalization of Semiconductors in Japan” of 2024, the Japanese Ministry of Economy, Trade and Industry recognized the decline of its chip industry. Furthermore, Fumio Kishida, former Prime Minister of Japan, has declared openly that his country depends excessively on the US in the critical scenario of AI. Be that as it may, Japan wants to make up for lost time. And Fujitsu is one of its best assets to regain its former glory. In fact, this company has announced, according to Nikkei Asiawhich is going to develop cutting-edge 1.4nm chips for AI that are entirely Japanese. This project will have a development cost of approximately 363 million dollars, although, and this is what is really important, the manufacturing of these integrated circuits Rapidus will take carea company that seeks to compete face to face in the medium term with TSMC and Samsung in the semiconductor production market for third parties. Rapidus advances with firm step Japan is currently investing more money in its integrated circuits sector than the US, Germany, France or the UK. Not in terms of net value, but their effort is greater if we weight the investment of these countries over their gross domestic product (GDP). The US dedicates 0.21% of its GDP to its semiconductor industry, and Germany 0.41%. France, according Nikkei Asia0.2%, and, finally, the United Kingdom 0.04%. The difference is very significant and highlights the effort that Japan is making with 0.71% of its GDP. As expected, Japanese companies have a leading role in the reconstruction plan for the Japanese chip industry. Tokyo Electron, Canon and Nikon are the leading designers and manufacturers of integrated circuit production equipment. AND JSR Corporation leads the production of photoresist materials. Curiously, it is necessary to pour these fluids over the silicon wafers in order to prepare them for the transfer of the geometric pattern that delimits the distribution of the transistors, the connections and the other elements that make up an integrated circuit. Rapidus Corporation has been created expressly to put Japan back at the forefront of chips The surprising thing is that, in reality, none of the companies I just mentioned are Japan’s best asset to catapult the competitiveness of its semiconductor industry. Not even JSR, which, as we have just seen, leads the manufacture of photoresist materials. The company that is destined to compete face to face with TSMC, Intel or Samsung in the chip production market is Rapidus Corporation. In fact, it has been created expressly to once again place Japan at the forefront of integrated circuits. Rapidus is a very young company. It was founded on August 10, 2022 by the Japanese Government with an initial capital of 7,346 million yen (just under 46 million euros) contributed by, and here comes the interesting part, Sony, Toyota, NEC, SoftBank, Kioxia, Denso, Nippon Telegraph and MUFG Bank. The initial capital invested in the constitution of this company is not very large, but there is no doubt that the companies that participate in it have unquestionable relevance in the technology, automotive and telecommunications sectors. The state-of-the-art semiconductor production plant that this company has set up in northern Japan, in the city of Chitose (Hokkaido), began wafer processing tests in a pilot line in April 2025. The plan of the management of this factory is to begin large-scale production of 2nm semiconductors in 2027. What is causing this Rapidus plant to attract the attention of the semiconductor sector is that, according to Atsuyoshi Koikewho is the president of the company, will be completely automated. Its purpose is to use robots and AI to set up an automated production line that will be specialized in the manufacture of 2nm chips for AI applications. Their plan is, ultimately, to produce integrated circuits faster, at a lower cost and with higher quality. And after 2 nm, as we have seen, 1.4 nm integrated circuits will arrive. Image | Generated by Xataka with Gemini More information | Nikkei Asia In Xataka | Japan takes the lead with nuclear fusion and sets an extremely ambitious date: the 2030s In Xataka | Japan has taken out the checkbook to once again dominate the chip industry. Prepare a plan of 325,000 million dollars

The demand for AI memories is suffocating mobile manufacturers. The largest Chinese chip producer is going to take advantage of it

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SMIC (Semiconductor Manufacturing International Corp) is the largest Chinese semiconductor manufacturer with a global market share of about 5%. This company is the best asset that Xi Jinping’s Government currently has to sustain China’s technological development. Hua Hong Semiconductor and SMES (Semiconductor Manufacturing Electronics Shaoxing) are also two very important chip manufacturers, but the true spearhead of this gigantic Asian country in this industry is SMIC. This company is partially public and has, as expected, the support of the Chinese Government. In fact, The Administration is investing a lot of money in their chip manufacturers. SMIC and the other Chinese chip producers do not have extreme ultraviolet photolithography (UVE), which are the most sophisticated that exist, but they do have the Twinscan NXT:2000i deep ultraviolet (UVP) equipment manufactured by the Dutch company ASML. These machines have not been designed to develop integrated circuits comparable to the most advanced ones currently manufactured by TSMC, Intel or Samsung, which is why the competitiveness of Chinese semiconductor manufacturers has suffered. Even so, SMIC has a plan to continue growing despite the impact that US sanctions are having on its business. And, according to SCMPis going to launch it now to take advantage of the bad times that manufacturers of smartphones and other consumer electronics devices are having. In March 2026. The memory supercycle for AI has put mobile phones on the ropes The DRAM memory industry is facing a profound structural transformation. The three largest chip manufacturers of memory on the planet, the South Korean companies SK Hynix and Samsung Electronics, and the American Micron Technology, They have reallocated about 70% of its production lines to high-bandwidth memories (HBM) to satisfy the currently insatiable demand of data centers specialized in artificial intelligence (AI). The current situation has triggered the birth of a supercycle in the memory market This situation has triggered the birth of a supercycle in the memory market, which is, simply, a presumably prolonged period of time during which the demand for a certain product far exceeds the offer. This scenario causes prices to skyrocket. In fact, that is what is currently happening with memory chips. And the big losers at the moment are the manufacturers of smartphones and other consumer electronics devices. This circumstance is precisely what SMIC wants to take advantage of to grow. And it plans to do so by trying to capture the entire low- and mid-range chip market that is being neglected. SK Hynix, Micron Technology and Samsung are focusing on the production of HBM integrated circuits because they leave them with a much higher profit margin than other memory technologies. SMIC cannot manufacture chips using cutting-edge photolithography beyond 7nmbut you don’t need them. Its current integration technologies are sufficient to manufacture the microcontrollers and memory chips demanded by mobile phone manufacturers. Image | Generated by Xataka with Gemini More information | SCMP In Xataka | We can forget about AI without hallucinations for now. NVIDIA CEO explains why

That Alibaba creates its own chip for AI agents is no surprise. Let it be neither ARM nor x86, but 5nm RISC-V, yes

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The Chinese giant Alibaba just announced the launch of its new high-end CPU, the XuanTie C950 processor. Developed by and for AI agents, it is a five-nanometer chip with a speed of 3.2 GHz whose surprise is not in any of these figures. The surprise is in its architecture, which is neither x86 nor ARM, but RISC-V. Therefore, it is not only the most powerful RISC-V processor created to date, but also a declaration of intent that can be summarized in two words: technological sovereignty. What is this chip about?. XuanTie CPUs are developed by Damo Academy, Alibaba’s research division. The previous model, the XuanTie C930, was announced on March 10 as the first server grade processor developed by Alibaba. Just two weeks later, the Chinese company has announced a new chip, the XuanTie C950, which is, according to the firm, three times more powerful than its predecessor (the C920 announced in 2024). Alibaba has not revealed which factory produced it, but it is based on the RISC-V architecturethat its process is five nanometers and that its speed amounts to 3.2 GHz. This launch occurs in a very particular context. Just a few days ago, and in response to the rapid adoption of OpenClaw by local companies, Alibaba Wukong announced.its platform for deploying AI agents in enterprise environments. This chip aims to improve the inference. In other words, the XuanTie C950 will serve to improve the computational process carried out by the language models in order to generate the responses that correspond to the requests they receive. In a context of agents working with files, data, and diverse environments, this is important. Processor prototype based on RISC-V architecture | Image: Wikimedia Commons Why RISC-V? Mainly, because unlike x86 and ARM, RISC-V is open and its use does not imply paying for licenses. According to Alibaba, “RISC-V’s open standard nature allows chip designers to customize instruction sets and accelerate specific AI workloads with little or no licensing costs. This is especially important for the development of AI agents.” Let’s think of RISC-V as what Linux is to Windows and Mac. If a company wants to use x86 (Intel and AMD) or ARM (SoftBank) architectures, it must pay a license. Not only that, but x86 and ARM are exposed to possible restrictions by the United States. With RISC-V, this risk disappears, which is why so much China like the European Union have found in it an escape valve towards sovereignty and technological independence. The surprising thing. That a Chinese company has managed to produce a five-nanometer chip is, to say the least, striking. To manufacture these processors it is necessary to use deep ultraviolet lithography (UVP) and, normally, machinery produced by the Dutch ASML. We know that SMIC (Semiconductor Manufacturing International Corp), the largest Chinese semiconductor manufacturer, had been at least since 2023 developing its own five-nanometer lithography, but with unacceptable results. When a chip wafer is manufactured, it is normal for some of its cores to malfunction. If we talk about profitability, the yield per wafer must be 70%that is, seven out of every ten cores produced work. In the year 2025, the yield of SMIC wafers was at 30%. That today, at the beginning of 2026, we see a five-nanometer chip produced, a priori, in China, would be a punch on the table by the Asian country and a strong sprint in the AI ​​race. However, it does not seem feasible. The other option, and perhaps the most plausible, is that it is not manufactured by SMIC, but by TSMC. SMIC has not managed to manufacture five-nanometer chips using the multiple patterning on your ASML UVP machines. The Taiwanese TSMC does have that capacity and, according to Nikkei Asiawill be the one who manufactures it. Be that as it may, it is a great step for the RISC-V architecture, which has gone from being relegated to small devices to reaching the league of the big ones. Featured image | Alibaba In Xataka | There is a city in China that goes head to head with Silicon Valley: welcome to Hangzhou, the home of the ‘Six Little Dragons’

China has started a battle against the US and Japan that no one is talking about. And it is crucial to winning the chip war

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In the semiconductor war that the US and China are fighting Companies that specialize in the manufacture of photolithography equipment tend to attract attention, such as ASML; those that design the chips, such as NVIDIA or AMD; and the companies that produce them, such as TSMC or Samsung. However, in this complex network there are other much less known companies that also play an essential role in the integrated circuit industry. One of them is the Japanese company JSR Corporation. This entity is one of the industrial strongholds of Japan. And it is because it supplies its photoresist liquids to most of the semiconductor manufacturers that produce cutting-edge chips, helping to sustain Japan’s leadership in a very important area that usually goes unnoticed: that of the manufacture of advanced materials to produce integrated circuits. For China to have its own advanced photoresist liquids in your path to total independence of its chip industry is crucial, so its plan involves break Japan’s monopoly in no more than five years. China prepares to intimidate Japan The photolithography equipment designed and produced by ASML is responsible, very roughly, for transferring the geometric pattern described by the mask with great precision to the surface of the silicon wafer. In this area we can observe the pattern as the “drawing” that delimits the distribution of the transistors, the connections and the other elements that make up an integrated circuit. Before transferring the geometric pattern to the wafer, it is necessary to pour a liquid capable of absorbing light and preserving the pattern on it. However, before reaching this very important step, it is necessary to subject the wafers to a process known as deposition. It usually involves equipment manufactured by Tokyo Electron or Applied Materials. Its purpose is prepare silicon wafers for the transfer of the geometric pattern by depositing a very thin layer of material on them. Depending on the type of chip being manufactured, it will be necessary to use one material or another. One of the most used deposition techniques is known as oxidation, and consists of taking advantage of the ability of silicon to form a very thin layer of oxide when reacting with water. Its purpose is to protect the transistors and other chip components from external contamination. However, before transferring the geometric pattern to the wafer using lithography equipment, it is necessary to pour a liquid capable of absorbing light and preserving the pattern on it. This is the function of the photoresist fluid. During the last two decades, all companies specialized in the production of photoresist materials have been Japanese. In fact, Japan has since then the monopoly of this marketwhich is currently led by JSR Corporation. For the US, one of its main allies should lead this market not a problembut the possibility of China developing the capacity to produce its own advanced photoresist materials on its path to cutting-edge chip manufacturing is an issue. The Chinese government knows that photoresist production is a critical bottleneck, which is why its latest five-year plan has set out to resolve it. Xuzhou B&C Chemical, which is one of the leading photoresist materials manufacturers in China, anticipates that in at most five years will have the capacity to produce large-scale advanced KrF photoresists (Krypton Fluoride) and ArF (Argon Fluoride). Precisely this last material is commonly used in nodes equipped with deep ultraviolet (UVP) lithography equipment. However, the great challenge facing China is the development of photoresists suitable for the production of integrated circuits in extreme ultraviolet (EUV) nodes. We will see what achievements it achieves over the next five years. Image | Generated by Xataka with Gemini More information | SCMP In Xataka | Japan takes the lead with nuclear fusion and sets an extremely ambitious date: the 2030s

China already has two chip manufacturers with 7nm technology. This is very bad news for the US and its allies.

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SMIC (Semiconductor Manufacturing International Corp), the largest Chinese semiconductor manufacturer, has the capacity to produce 7nm chips from 2023. At the beginning of September of that year this company shook up the integrated circuit industry by demonstrating that it had been able to manufacture these semiconductors despite not having access to UVE photolithography equipment (extreme ultraviolet) produced by the Dutch company ASML. These highly sophisticated machines are necessary to manufacture cutting-edge chipsand ASML cannot sell them to its Chinese customers because the US, which controls some of the patents used by this equipment, prohibits it. Still, in 2023 SMIC and Huawei worked hand in hand to manufacture 7nm ICs without using ASML’s EUU machines. Of course, they used deep ultraviolet (UVP) equipment that this company from the Netherlands also produces. UVP machines are not as advanced as UVE machines, but with proper refinements they can be used to manufacture cutting-edge integrated circuits. And now China has two semiconductor manufacturers capable of producing 7nm chips. As we have just seen, one of them is SMIC, and the other, according to Reutersis Hua Hong Semiconductor, the country’s second largest integrated circuit producer. The shadow of ‘multiple patterning’ is very long Hua Hong Semiconductor’s division specializing in third-party chip manufacturing is called Huali Microelectronics, and, again according to Reutersis preparing to start production of 7nm integrated circuits at its Shanghai plant. The sources that have revealed this information assure that Huawei has collaborated with Huali Microelectronics on this project, which invites us to reach two reasonable conclusions. It is very likely that with the help of Huawei, Huali has developed ‘multiple patterning’ techniques The first is that Huali’s 7nm lithography will most likely play an essential role in GPU production capacity for artificial intelligence (AI) from both Huawei and other Chinese companies. And the second conclusion is actually a plausible hypothesis. And, like SMIC, Huali does not have access to ASML SVU equipment. For this reason, it is very likely that with the help of Huawei it has developed security techniques. multiple patterning to be able to manufacture 7nm chips with the UVP machines in its possession. A priori, UVP machines are suitable for manufacturing semiconductors up to 10 nm. And with EUVs it is possible to exceed 3 nm. However, by refining the processes involved in transferring the pattern to the wafer and turning to multiple patterning It is possible to go beyond these integration technologies. This technique broadly consists of transferring the pattern to the wafer in several passes with the purpose of increasing the resolution of the lithographic process. It may have an upward impact on the cost of chips and a downward impact on production capacity, but it works. Either way, Huali Microelectronics is going to face the same challenges that SMIC has dealt with for the last three years: the multiple patterning seriously limits the number of viable chips per wafer that is possible to manufacture. And, therefore, it increases its cost. Still, it is very important for Chinese AI chip designers to have access to two companies capable of producing their designs with advanced photolithography technology. And for Hua Hong Semiconductor it is crucial to have the ability to manufacture, thanks to Huali, cutting-edge integrated circuits and not just 22 nm or larger (this is the most advanced photolithography it had so far). Image | Generated by Xataka with Gemini More information | Reuters In Xataka | TSMC is already the highest-earning chipmaker on the planet. It has beaten two semiconductor giants

It took Apple to put the iPhone chip in a computer so that we know that the iPhone is as powerful as a computer

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He MacBook Neo It is surprising analysts and buyers with its good performance. And the question should be: why? It is the first time that Apple has made a move of this caliber to make one of its star products cheaper: putting the processor of an iPhone inside a Mac. We consumers have so internalized that “a cell phone is a cell phone” and that “a PC is a PC” that, usually, we do not pay attention to what we usually have in our pockets. It took Apple to put the processor of an iPhone in a PC to realize that, precisely, what we have in our pocket is a PC. “Move up to 4k videos”. X is filled with analysts thoroughly testing the MacBook Neo, and hallucinating that it is capable of doing… what any other MacBook can do. The 8 GB of RAM is a limitation, as it was in the first generations of Macs with M1 chip. But, far from that “use for office, basic and browser”, the Neo is surprising for being capable of what is expected of a Mac: do more than that. The main limitation is given by the 8 GB of RAM, which is few even for a Mac, but not by the chip. It’s normal. A Mac with a mobile chip. It sounds like a crazy idea. But if we look (not even in depth) at A18 Prowe understand perfectly what is happening. No matter how much Apple mounts the A18 Pro in a mobile phone, it is a chip that far exceeds the capabilities that even a desktop or laptop would need for “basic use.” In fact, the A18 Pro scores above an M1 in Single-Core, it is not far behind in graphical performance and is much more advanced at the manufacturing level (number of transistors, instructions, frequencies). In fact, it’s not just an Apple thing: a Snapdragon 8 Elite sweeps an M1 in multi-core and reaches a M2 in single. We weren’t realizing. We have been saying for years that the power of mobile phones is completely excessive. A certain part is necessary for the highest-end mobile phones to be able to record in 8K, process images in real time and operate at the rate they work, but 90% we are driving at 30 km/h in a supercar that exceeds 300. This is not something new. In fact, for years Apple’s A processors were outperforming Intel’s, back in the days when M chips didn’t exist. As told John Gruberthe A9 CPU of the iPhone 6s In 2015 (it has rained) it was already comparable to MacBooks from 2013. In 2017, as he says Antonio Sabanthe iPad Pro was already faster than the MacBook Pro with the I7 chip. Just what was needed. Macs have historically been characterized as a perfect mobility solution for designers, musicians, video editors and other creators. But there was an even bigger niche: people who don’t do any of that and want a computer for “normal” use. While MacBook Airs are not over-the-top Macs, they offer much more than any average user needs. In fact, I myself bought an Air M4 and not a Pro because, even as a video editor, I don’t need much else. Apple has found in the Neo more than possibly the “e” phenomenona formula that we will see year after year if we achieve commercial success. Image | Apple In Xataka | Apple has only found one option to make a cheap laptop: make it a mobile

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