Samsung, SK Hynix and Micron are already working on DDR6 while memory prices continue to skyrocket

The market is going through an unprecedented component crisis. In 2020, a perfect storm caused there to be no chips, but it was known that the storm would pass sooner rather than later. The problem is that the storm of current NAND chip crisis It doesn’t look like it’s going to give us a break in the short term. All memory manufacturers have focused on creating chips for artificial intelligence platformsbut in the meantime, they continue developing DDR6 memories. It will take a long time for consumers to be able to taste them. In short. DDR5 memory has not had a normal life cycle in the consumer market. It was expensive and, when prices began to drop, AI hyperscalers arrived to take over everything available. This is how we have reached a situation in which just 32 GB exceeds the 400 euros: all production is focused on hyperscalers and there are no ‘pills’ for consumption. However, that doesn’t mean that DDR5 has done poorly, not at all. Samsung or SK Hynix they are breaking records and, for them, things are working out great. That is why, together with Micron, they are starting to prepare the ground for the new technology: DDR6 memories. Last year JEDEC (the consortium that is responsible for standardizing DDR, LPDDR and NAND microelectronics) already detailed the standard LPDDR6 and it seems that the fringes are being polished for DDR6. Now, as we read in Wccftechthe big three of memory They are warming up for the near future with their new generation. Performance leap. These new memories will not only be faster. It talks about speeds minimum of 8,800 MT/s according to that JEDEC standard, but can reach up to 17,600 MT/s as the technology develops. They would practically double the performance of DDR5 and the trident of the RAM it takes a few months working together with Intel, AMD and Nvidia in the prototype validation processes. But it’s not just about pure speed, but about architecture. About 2×32-bit DDR5 RAM we would pass to a 4×24-bit subchannel architecture. It is something that brings challenges when it comes to managing temperatures and consumption, but also presents a clear advantage: improved parallelism and greater use of bandwidth. Plate change. For players, that is going to be a little problem, since an architecture change usually entails a board change. And, if the rumors and leaks are true, that plate change will be assured. The reason is that there are sources that they point that CAMM2 is going to gain a lot of weight with DDR6, especially in laptops and compact computers, and could gradually displace the traditional DIMM in certain segments. If this doesn’t tell you anything, visualize how RAM is mounted on a current motherboard. These are modules that are mounted perpendicular to the plate, something that has been around for years and that, although it has been functional for a long time, presents friction when you want to reach certain speeds. On the contrary, we have M.2 SSDs that are mounted in parallel, just like the LPDDR memory of laptops. Precisely, this is what these DDR6 tablets would be like, so manufacturers would have to redesign their boards to adapt either from the front or by adding the connectors to the back of the plate. Context. You probably have two questions in mind: how much DDR6 memory will cost and why the rush. We cannot answer the first question, but for the second question we can guess where the shots are going. We have commented that DDR6 RAM will come hand in hand with a notable improvement in bandwidth, and that is something that the artificial intelligence industry is desperately looking for. Until now, there were many powerful GPUs in data centers to train AI models, but in the era of Agentic AIwhat is needed is equipment more similar to a traditional PC. This is why Intel and AMD sand they are moving to mass-produce their professional processors again, and that is where DDR6 memory would make perfect sense thanks to that improvement in bandwidth. For inference, it’s great. It is already being tested with an arrival on the market for 2028 or 2029, but it will be the hyperscalers who monopolize all DDR6 memory production. Only when the voracity of data centers calms down will the modules begin to reach the mass consumer market. The translation is that Micron, SK Hynix and Samsung are already working on it, but to be able to build a desktop PC with DDR6 there are several years ahead. In the meantime, I’d say we can settle for DDR5, but looking at the prices… Image | Luan Gjokaj (edited) In Xataka | The RAM crisis is destroying all of Valve’s plans with its Steam Machine

DDR6 memories promise a new era for the PC. And also a new way of riding them

The next generation of RAM memories It is getting closer. While we continue adapting to DDR5the industry It already works at full speed in the DDR6, which promise to double the current performance and arrive in a novel format for the domestic user. Under these lines we wanted to collect everything we know about this new version so far. Vertigo speeds. DDR6 do not promise a simple evolution. And they will also offer a radical change in memory architecture. With Minimum speeds of 8,800 mt/s According to the Jedec standard and the possibility of reaching 17,600 mt/s, they practically double the performance of the current DDR5. Samsung, Micron and Sk Hynix They have already passed the prototype phase and work together with Intel, AMD and NVIDIA in the validation processes. THE SECRET OF THE PERFORMANCE. The key is in The new 4 × 24-bit sub-channel architecturecompletely different from the 2 × 32-bit structure of DDR5. This change allows to manage more data simultaneously, but also introduces new challenges in the integrity of the signal. Jedec is evaluating the use of NRZ standard (Non-back to zero) For communications, abandoning the current PAM system that already shows limitations with the highest speeds of DDR5. Goodbye to traditional modules. Here comes the most visual change: DDR6 is likely adopt the CAMM2 formatwhere the modules are placed in parallel to the motherboard instead of perpendicular such as the Dimm and So-Dimm of a lifetime. This modification has its explanation. And it is that the current Topology of the memory slots generates interference that limit the maximum speed up to 400 mt/s. CAMM2 eliminates these problematic welded connections and transfers signal management to the module itself. A change when setting up a PC. The change of format involves completely redesigning the motherboards, but opens new possibilities. CAMM2 connectors could be located at the back of the plate, allowing more compact factors. Although initially require several screws for their fastening, Jedec works on installation systems without tools. In parallel, everything indicates that we will see more portable and Mini PCs with Solded memory directly (something increasingly common today), sacrificing the ability to expand for better performance. In a few years. The deadlines are more or less clear. The validation of platforms will begin in 2026, they will reach servers in 2027 and the availability for consumers is expected to be between 2028 and 2029. This staggering is similar to that with DDR5, but analysts predict faster adoption in artificial intelligence environments and high performance computing. Everything indicates that the initial prices will also remember those of DDR5 in 2021, limiting early adoption to data centers and research laboratories. What comes after. DDR6 will not only offer more speed: they promise greater energy efficiency and higher capabilities thanks to New NAND chips in development. For players and content creators, it will mean more bandwidth for work loads that involve AI and demanding applications. However, this evolution will require new motherboard, compatible processors and a different way of mounting a PC. Cover image | Andrey Matveev In Xataka | The milling of a programmer made a fateful mistake of this classic video game into a congratulation message

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