The South Korean company SK Hynix leads the HBM memories market (High Bandwidth Memory) With a shocking authority. Your market share Broken 70%so that the remaining 30% are distributed by Samsung and the American memory manufacturer Micron Technology. These memoirs work side by side with the GPUs for artificial intelligence (AI). In fact, one of SK Hynix’s main clients, possibly the oldest, is Nvidia.
According to the consultant Datam Intelligence The global market centers market for AI will grow annually 24.5%, so it will go from having a volume of 13,670 million dollars in 2024 to no less than 78,910 million in 2032. For designers and integrated circuit manufacturers compete in a market with this growth potential is crucial, hence several Chinese companies are planning to get into it. And for Intel represents a too juicy opportunity to let it escape.
Intel and Softbank work together in a new type of memories for ia
The manufacture of HBM memories is very complex. This is the reason why this market at the moment is distributed only to the three companies that I have mentioned in the first paragraph of this article. However, its great growth potential will surely cause other companies over the next few years. Intel is going to be one of them, although the interesting thing is that he will not compete alone or fight for the HBM chip market.
Intel and Softbank have proposed to complete the development of a prototype and evaluate its viability from a technical point of view by 2027
This American company has founded a company specialized in the design and manufacture of memory chips from the Japanese investment group. His name Saimemory And he was born expressly to compete from you to you with SK Hynix, Samsung and Micron Technology. Your plan consists in developing a new type of High performance packed dram memory From some patents prepared by Intel and several Japanese research centers, among which is the University of Tokyo.
Intel and Softbank have proposed to complete the development of a prototype and evaluate its viability from a technical point of view by 2027. In fact, they intend to manufacture on a large scale and market this dram memory stacked for ia before it ends this decade. The performance of HBM memories is very high, but, as I mentioned a few lines above, they are difficult to manufacture. In addition, they are expensive, they dissipate a lot of energy in the form of heat and consume a lot of electricity.
Stacked dram memories, however, on paper will be easier to produce, more efficient, and also cheaper. If when they are really satisfied the expectations that have generated it is possible that They end up displacing HBM chips. In fact, Intel and Softbank are not at all the only companies that trust the potential of stacked dram memories; Samsung and Neo Semiconductor are also developing this type of chips, so before the Memoirs market expires this decade will be much more competitive than today.
Image | Samsung
More information | Nikkei Asia
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