load the chips with 18A

Lip-bu Tan, that for a few months He took Pat Gelsinger’s witness As Executive Director of Intel, he is considering An important strategic turn in its chips manufacturing division. The play goes through betting directly on the 14th technology instead of The 18A processin which his predecessor Pat Gels had invested billions of dollars. It would not be the first time that Intel leaves a manufacturing node in this way. A crisis that is maintained despite the change of leader. Intel has been losing ground in front of TSMC for years, the Taiwanese giant who dominates the manufacture of chips for colossal clients such as Apple or Nvidia. That the company has shown signs of wanting to focus on the following manufacturing node and abandon the 18A process (in force for its next Panther Lake processors) represents one of the most risky movements to try to recover competitiveness in a sector where Intel has ceased to be a leader after decades of domain. The strategy of such. Since assumed office in Marchthe new CEO has acted quickly to reduce costs and find new growth paths. Its proposal is to concentrate resources in the 14A process, considered more competitive in the face of TSMC technologies, and slow down the 18A marketing to external clients. This decision could involve throwing hundreds of millions, or even billions, dollars in investments already made. The risks are huge. Leaving the 18th would mean assuming millionaire losses due to the investments made, but maintaining it could further away to the great clients that Intel needs for their contract manufacturing division. The company already He has committed Small 18A production volumes with Amazon and Microsoft, but these contracts would not change with the new strategy. The financial context. Intel is going through one of the deepest crises in its history. In 2024 he registered his first year with losses since 1986, with red numbers of 18.8 billion dollars. The company has already fired more than 15,000 employees Since 2024 and planned to cut between 8,000 and 10,900 additional workers from its factories between June and July. What comes now. The Board of Directors of Intel will analyze the options proposed by so at its meeting this month, although the final decision could be delayed until autumn given the complexity of the matter. Meanwhile, Intel will continue to use the 18th for his own chips and fulfill the commitments already acquired with some clients, but the future of their manufacturing division will depend on whether it manages to convince the market that the 14th can really compete with TSMC. Cover image | Intel In Xataka | AI is one of the most advanced technologies that the human being has built. It also gets distracted with a cat

Intel’s future is linked to the success of a single chip manufacturing node: 18A technology

Intel is facing one of the most difficult stages Of all its history. And its story is not exactly brief. In fact, Gordon Moore and Robert Noyce founded this company more than half a century ago, in 1968. As we have explained in other articles, The future of factories and Intel chips packaging and validation centers is uncertain. However, it is possible that these facilities are finally incorporated into a joint company Managed by Intel, TSMCand, perhaps, by some other company of the integrated circuit industry. Anyway, the short -term competitiveness of this company is closely linked to the success of a single semiconductor manufacturing technology: 18A photolithography. Ben Sell, Vice President of Intel Technology Development, confirmed At the end of last September that the 18A node already has the maturity necessary to enter large -scale production in 2025. and also assured that it will benefit from the resources that have been reallocated since the 20A node. In the current scenario the 18A node will be the true protagonist. That is not the slightest doubt. More transistors. More performance. And less consumption This statement by Joseph Bonetti, main manager of Intel engineering programs, expresses very well The important thing that is the 18A node for this company: “Intel leaders, Board of Directors of Intel and Donald Trump administration, please do not sell or give the control of Intel Foundry to TSMC just when Intel is taking the technological front and starting to take off. It would be a terrible and demoralizing error.” Bonetti also maintains that Intel is not lagging for its competitors, and that the advances that their engineers are achieving in the field of chips production are very important. Bonetti does not expressly mention the 18A integration technology, but his statement is supported by it because right now is the asset that Intel has to compete with TSMC and Samsung in the market for the production of integrated circuits in a year in which 2 Nm photolithographies They will take off yes or yes. In the last months Intel has been revealing some of the characteristics of this integration technology, but just a few hours ago and as a prelude to the semiconductor conference ‘2025 Symposium on VLSI Technology and Circu has made public more interesting data. Powervia proposes to physically separate the feed lines and signal signal within each integrated circuit Lithography 18a is erected above all about two essential innovations: Ribbonfet Gate-Lall-Around (GAA) transistors and energy delivery technology Powervia. The purpose of this last improvement is to solve the limitations imposed by the introduction in the integrated circuit of smaller transistors, which are also together more. This scenario causes that within each chip the power lines and signal compete for the same resources, which triggers the appearance of bottlenecks that perceptibly limit the performance and energy efficiency of a CPU. The purpose of Powervia technology is precisely to solve this problem. And to achieve this, what proposes is to physically separate the power lines and signal signal. So far both lived in the same physical space, but From Intel 20A lithographythat It was commercially dismissed In September 2024, the distribution of transistors and food and signal will acquire the form of a sandwich. In this way the transistors will be housed in the center, while the feed lines will reside in a lower layer and those of signal in an upper layer. In any case, for us, the users, the most interesting thing is to know that Intel promises that their lithography 18a will deliver a 25% higher performance using the same voltage as the integration technology Intel 3, as well as a 36% lower energy consumption by using the same frequency and the same voltage. And by reducing this last parameter and moving from 1.1 volts to 0.75 volts, lithography 18a delivers a performance of 18% higher and a consumption of 38% lower. It sounds good, but we should not ignore that This information comes from Intel itself. Whether it is evident that we are interested in consumers that both Intel and TSMC or Samsung have the best state possible. Image | Intel More information | Intel In Xataka | Intel has confirmed that the 20A node will be skipped to reduce expenses. The 18A node will enter production in 2025

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