Russia plans to manufacture its own 28 Nm chips in 2030. It will continue to be light years from the US and its allies

The relationship sustaining USA and Russia is disturbing. The interests of the administration led by Joe Biden They seemed hardly reconcilable with those of the Government of Vladimir Putin, but Donald Trump’s return to the White House The rules of the game have changed. It had been many years that the interests of Russia and the US were not as aligned as they seem to be now. At this situation it would not be strange for Trump -led administration to Advanced lithography equipment.

At the moment it is only an elucubration, but in the current circumstances it is not a far -fetched possibility. Anyway Russia has a plan to reinforce your semiconductor industry and reduce their dependence on foreign technologies. In October 2024 the Ministry of Industry and Commerce announced that it will invest 2,540 million dollars until 2030 in the development of own photolithography machines that allow it to become independent of foreign powers. Within the framework of the Russian economy it is an important expense that in the medium term seeks to develop the ability to make chips of 28 nm.

Russia says you are already making chips with its first UVE lithography team

At the end of May Vasily Shpak, Deputy Minister of Industry and Commerce of the Russian Federation, advertisement During the conference “Industrial Russia Digital Industry” that your country already has prepared its first team of extreme ultraviolet photolithography (UVE). In addition, Shpak confirmed that its construction is entirely Russian, and, more importantly, it also anticipated that this first UVE machine is capable of manufacturing integrated circuits of 350 nm.

The really important thing is that Russia apparently already has the necessary technology to tuning these photolithography machines. From here their engineers and physicists can gradually refine their technology to make possible the production of more advanced integrated circuits. In fact, it is fair What the Russian government plans to do. And its itinerary establishes that in 2026 Russia should have a prototype of UVE lithography equipment capable of manufacturing 130 nm chips. And in 2028 another similar one trained to produce integrated 7 nm circuits.

However, it is important that we do not overlook that this itinerary does not describe the moment in which Russia will acquire the ability to manufacture these large -scale integrated circuits. This will be the really relevant milestone. Whatever the Russian medium COMNEWS He has collected statements from Konstantin Trushkin, the deputy director of development of the MCST CPU Design Company, in which this engineer argues that Russia will have plants capable of producing large -scale integrated circuits of 28 Nm between 2028 and 2030. This purpose is credible, but by then presumably TSMC, Intel and Samsung will already have the capacity to manufacture in a massive way 1 Nm semiconductor.

More information | COMNEWS

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