He has found a way to shoot China’s competitiveness in the face of the US

Two days ago we told you something very interesting: the Chinese state medium Securities Times had revealed that Huawei was about to present a technological advance that pursued Reduce China dependence of HBM memory chips (High Bandwidth Memory) from abroad. According to this source Huawei was going to officially announce his technological milestone a few hours later, during the celebration in Shanghai (China) of the Applications Forum and Development of Financial Reasoning 2025. Huawei has fulfilled what was promised, although not as we had planned. In any case, before getting into flour it is important that we remember that Chinese memory chips manufacturers They are not producing solutions capable of competing with the most advanced memories manufactured by South Korean companies Samsung and SK Hynix, or the American Micron Technology. GPUs for Ia work side by side with HBM memory chips. In fact, its performance is largely conditioned by these memories. As the editors of SEMIANALYSISthe total bandwidth of the HBM3 memory chips that live with some of THE GPU FOR THE MOST ADVANCED Nvidia or AMD exceeds 819 GB/s, while DDR5 and GDDR6X memories reach much more modest 70.4 GB/Sy 96 GB/s. HBM3E memories and future HBM4 are even better. Chinese manufacturers of this type of chips do not yet produce this kind of memories, but it seems that Huawei will deeply alter this scenario. An algorithm expressly designed to accelerate inference in AI The filtration that occurred scarcely 48 hours suggested that probably what Huawei was going to present was a avant -garde packaging technology that, perhaps, would rival those used by SK Hynix, Samsung or Micron to produce their HBM3 and 3E memories. And it is that manufacturing these integrated circuits is complex because they require stacking several DRAM chips and implementing an interface between the XPU (Extended Processing Unit) or extended processing unit and extraordinarily dense HBM chips. As a button shows: in a HBM3E stack the XPU and the HBM memory are linked through more than 1,000 drivers. According to Huawei, the UCM algorithm is capable of drastically accelerating inference in the great AI models However, finally Huawei has presented a different technology: an advanced algorithm called UCM (Unified Cache Manager) that, according to this company, it is capable of drastically accelerate inference In the great models of artificial intelligence (AI). A relevant note: inference is broadly the computational process carried out by language models with the purpose of generating the responses that correspond to the requests they receive. To achieve its purpose, the UCM algorithm displays a very ingenious strategy: decide in what type of memory it is necessary to store each data taking as a fundamental indicator the latency requirements. In practice, this algorithm behaves as a gigantic cache that guarantees that each data will go to the right memory, including HBM3, with the purpose of minimizing latency during inference. If it is a very often used data, it will be stored in a very fast memory, such as HBM3. According to Huaweithis technology is able to reduce the latency of inference by 90%. Interestingly, this company plans to do the UCM Source Open Algorithm in September. More information | SCMP In Xataka | Nvidia has to deal with the absolute distrust of several US legislators. His plan in China is in danger In Xataka | The US wants to end the chips for the Chinese that are sold abroad. And China knows how to defend oneself

Huawei says that it has resolved a technological challenge that will trigger China’s competitiveness in the United States

In the field of hardware development for artificial intelligence (AI) China is advancing with the hand brake. The impossibility of accessing equipment extreme ultraviolet photolithography (UVE) that designs and manufactures the Dutch company ASML prevents Chinese chip manufacturers Produce GPU for comparable to the most advanced that manufacture NVIDIA, AMD or brains, among other western alignment companies. In addition, for the moment the Chinese chips manufacturers They are not producing solutions capable of competing with the most advanced memories manufactured by South Korean companies Samsung and SK Hynix, or the American Micron Technology. GPUs for Ia work side by side with HBM memory chips (High Bandwidth Memory). In fact, its performance is largely conditioned by these memories. As the editors of SEMIANALYSISthe total bandwidth of the HBM3 memory chips that live with some of THE GPU FOR THE MOST ADVANCED Nvidia or AMD exceeds 819 GB/s, while DDR5 and GDDR6X memories reach much more modest 70.4 GB/Sy 96 GB/s. HBM3E memories and future HBM4 are even better. Chinese manufacturers of this type of chips do not yet produce this kind of memoirs, but a filtration ensures that Huawei will change this scenario today. Huawei plans to give China the impulse it needs in the memoirs According to SCMPthe Chinese state medium Securities Times has revealed that Huawei is about to present a technological advance that seeks to reduce China dependence on HBM memory chips from abroad. According to this source Huawei will officially announce its technological milestone within a few hours, during the celebration in Shanghai (China) of the Application Forum and Development of Reasoning of Financial 2025. In a HBM3E stack the XPU and the HBM memory are linked through more than 1,000 drivers At the moment we do not know anything else, but it is reasonable to anticipate that what Huawei will produce your HBM3 and 3E memories. And it is that manufacturing these integrated circuits is complex because they require stacking several DRAM chips and implementing an interface between the XPU (Extended Processing Unit) or extended processing unit and extraordinarily dense HBM chips. As a button shows: in a HBM3E stack the XPU and the HBM memory are linked through more than 1,000 drivers. SK Hynix, Samsung and Micron are manufacturing on a large scale, although with different success12 -layer HBM3E memories. The two South Korean firms will produce large -scale HBM4 chips during the second semester of 2025, and Micron will do so in 2026. However, CXMT (Changxin Memory Technologies), one of the Chinese companies specialized in the production of memoirs, will launch Your first HBM3E chips in 2027. SK Hynix leads the HBM memories market with a shocking authority. Your market share Broken 70%so that the remaining 30% are distributed by Samsung and Micron Technology. Behind them they step stronger and louder the Chinese chips manufacturers of Yangtze Memory Technologies Co. (YMTC) and CXMT, who have chosen to compete in this attractive market deploying a very aggressive price policy. CXMT in particular has increased its production capacity of DRAM chips almost five times during the last four years, which has allowed it to increase its global market share Until a very worthy 9%. More information | SCMP In Xataka | Chinese memory chips manufacturers are a nightmare for the US and South Korea. There is a lot at play

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