circumvents

The extreme ultraviolet lithography (EUV) is the tightest bottleneck in the entire semiconductor industry. Only one company in the world, the Dutch ASML, manufactures these machines, essential for producing integrated circuits below 7 nm, and since 2019 is prohibited from selling its most advanced models to China due to US pressure. Each device costs between 200 and 400 million dollars, and so far not a single Chinese client has managed to obtain one. A team from the Chinese Academy of Sciences, based at the Shanghai Institute of Optics and Precision Mechanics, has built China’s first laser-plasma EUV light source platform. In front is Lin Nanformer ASML scientist and technical manager of its light sources for metrology, who returned to China in 2021 as part of a state talent attraction program. His team has chosen a path that deliberately avoids ASML’s method, as well as more than 2,000 of its patents. Qiu Yanfang, Chinese columnist specializing in semiconductors, has summed it up unambiguously: This patent rodeo is not just a legal maneuver; It’s genuine engineering. And it is this assessment, published just two weeks ago, that has once again put the focus on how far China has really come in its race for technological independence in lithography. The longest road to mass production The technical trick is this: while ASML generates EUV light by firing powerful carbon dioxide lasers at moving tin droplets (a method known as LPP), Lin Nan’s team uses a 1-micron solid-state laser that hits a solid tin target. In a published article In December 2024, Lin and his team were already arguing that this type of laser could replace carbon dioxide lasers as a next-generation source thanks to its compact size and higher conversion efficiency. However, Qiu Yanfang herself qualifies her initial enthusiasm. In the short term, he maintains, this solid-state source cannot shake ASML’s dominance, since the entire global semiconductor industry has built its supply chains, patents and engineering expertise around the carbon dioxide laser. Although Chinese technology achieves results in the laboratory, it still has a long way to go until achieve large scale production. The real value of Lin’s achievement, in any case, lies in laying the foundation and forging a research team that covers everything from theory to applied engineering. The Chinese Government aims to produce chips with this technology in 2028, although many analysts consider 2030 a more realistic date. This effort also coexists with another parallel and much more hermetic path. As revealed Reuters As of December 2025, China has assembled a working prototype EUV machine inside a high-security laboratory in Shenzhen, although it has not yet manufactured functional integrated circuits. Huawei coordinates this initiative, which involves thousands of engineers: the Harbin Institute of Technology is in charge of the light source, the Changchun Institute of Optics for the optical systems, and SMEE (Shanghai Micro Electronics Equipment) of the final integration, with YesCarrier (the Chinese company backed by the Shenzhen Government and linked to Huawei) as another of the key actors. The Chinese Government aims to produce chips with this technology in 2028, although many of the analysts consider 2030 a more realistic date. For now, no Chinese prototype has proven to be capable of manufacturing commercial integrated circuits with its own UVE lithography, and doubts about the real speed of this advance have returned to the front line of information for a very different reason. US Secretary of Commerce Howard Lutnick has raised ASML senior managers the possibility that one of its SVU teams has reached China through clandestine channels, something that the Dutch company has denied emphatically: none of its 314 operational EUV machines in the world, nor is any of the 26 already withdrawn located in Chinese territory. China does not have its EUV machine yet. But, thanks to Lin Nan, it now has something that until recently it didn’t have either: its own path to try to build it. Image | ASML More information | Asia Times In Xataka | ASML’s new lithography equipment divides chipmakers. TSMC plans not to use it until 2030