China has no choice. Or develops its own manufacturing technology of avant -garde semiconductors or will lose its struggle for world supremacy With the US. No 100% Chinese advanced chips their military capacity, the development of their models of artificial intelligence (AI) and the competitiveness of their technology companies will resent in the medium term. Huawei and SMIC are manufacturing advanced integrated circuits, but use machines from the Dutch company ASML and a technology known as Multiple patterning that compromises its competitiveness.
This scenario has caused the Chinese government support with very juicy subsidies to companies that have the ability to develop avant -garde photolithography equipment, such as SicarrierShanghai YuliangSheng, Shanghai Micro Electronics Equipment (Smee), Huawei or SMIC. Time plays against this Asian country. How much later in having their own machines of extreme ultraviolet lithography (UVE), which are those used to make very high integration chips, more delayed will be in front of the US and its allies.
2026 will be a crucial year for China in the field of chips
The Chinese Academy of Sciences is finishing what is undoubtedly The most ambitious project How many are developing the Chinese semiconductor industry. Thanks to this plan the nation led by Xi Jinping is about to reach a “Deepseek” in the field of integrated circuit industry. This simply means that it is preparing to reach a disruption that has the potential to place this Asian country at the same height as the US, Taiwan or South Korea.
However, China’s strategy to produce avant -garde chips is very different from what their rivals have used until now. Each of ASML UVE machines incorporates its own ultraviolet light source, but the Chinese Academy of Sciences seeks to generate this important radiation to produce advanced chips using a syncrotronwhich is nothing other than a circular particle accelerator that is used to analyze atomic level the properties of matter, such as various types of materials, or even proteins. It’s called heps (High Energy Photon Source or high -energy photons source), it is in Beijing and we can see it in the cover photography of this article.
Heps syncrotron has the ability to produce high power UVE light
An important note before moving forward: the ultraviolet light (UV) is responsible for transferring the geometric pattern that contains the design of the chips to the Silicon wafer. This means, in broad strokes, that the UVE light has the ability to make possible the manufacture of integrated circuits with a greater resolution than the deep ultraviolet light (UVP) that use the previous generation lithography machines that China has in their hands. And a greater resolution in practice implies that it is possible to produce semiconductors with more transistors, and, therefore, more sophisticated and powerful.
A priori we can think that a particle accelerator has nothing to do with the manufacture of integrated circuits, but we would be overlooking something very important: the Heps syncrotron has the ability to produce high power UVE light. In fact, it is a source designed to generate a large amount of radiation. China’s plan is to place around the particle accelerator Several semiconductor manufacturing plants to which the syncotron will deliver the UVE light in the same way that a power plant delivers electricity to its customers. That simple. The date on which China plans to start this megaphabrum of avant -garde semiconductors has not yet leaked, but it is already very advanced.
However, China’s plans do not end here. In the middle of last March several Asian media collected a photograph taken at the Huawei Research Center in Dongguan, in the province of Canton, in which it appeared The prototype of a UVE lithography team Designed and manufactured entirely in China. Presumably this machine is similar to those produced by ASML, which invites us to anticipate that for 2026 the country led by Xi Jinping will have the ability to produce advanced chips on a large scale.
This Chinese lithography equipment uses an LDP type ultraviolet source and not LPP class
The leaks They assure That unlike the UVE machines produced by the Dutch company ASML, this Chinese lithography equipment uses an LDP ultraviolet light source (laser induced discharge), and not LPP class (plasma generated by laser). Presumably The development of this ultraviolet radiation emission source It is the milestone that has allowed Chinese engineers to develop a machine that Many experts did not see possible before five years in the best case.
At the moment the most prudent is that we take this information with caution, but it seems solid enough to echo it. An interesting note is that on paper the LDP source is able to generate UVE light with a wavelength of 13.5 nm, so this Chinese prototype should be able to compete from you to you with ASML UVE photolithography machines. In addition, the leaks argue that China will begin the production of more test machines during the third quarter of this year with the purpose of launching the large -scale manufacture of these equipment during 2026.
Image | Dr. Kim
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