In the field of hardware development for artificial intelligence (AI) China is advancing with the hand brake. The impossibility of accessing equipment extreme ultraviolet photolithography (UVE) that designs and manufactures the Dutch company ASML prevents Chinese chip manufacturers Produce GPU for comparable to the most advanced that manufacture NVIDIA, AMD or brains, among other western alignment companies.
In addition, for the moment the Chinese chips manufacturers They are not producing solutions capable of competing with the most advanced memories manufactured by South Korean companies Samsung and SK Hynix, or the American Micron Technology. GPUs for Ia work side by side with HBM memory chips (High Bandwidth Memory). In fact, its performance is largely conditioned by these memories.
As the editors of SEMIANALYSISthe total bandwidth of the HBM3 memory chips that live with some of THE GPU FOR THE MOST ADVANCED Nvidia or AMD exceeds 819 GB/s, while DDR5 and GDDR6X memories reach much more modest 70.4 GB/Sy 96 GB/s. HBM3E memories and future HBM4 are even better. Chinese manufacturers of this type of chips do not yet produce this kind of memoirs, but a filtration ensures that Huawei will change this scenario today.
Huawei plans to give China the impulse it needs in the memoirs
According to SCMPthe Chinese state medium Securities Times has revealed that Huawei is about to present a technological advance that seeks to reduce China dependence on HBM memory chips from abroad. According to this source Huawei will officially announce its technological milestone within a few hours, during the celebration in Shanghai (China) of the Application Forum and Development of Reasoning of Financial 2025.
In a HBM3E stack the XPU and the HBM memory are linked through more than 1,000 drivers
At the moment we do not know anything else, but it is reasonable to anticipate that what Huawei will produce your HBM3 and 3E memories. And it is that manufacturing these integrated circuits is complex because they require stacking several DRAM chips and implementing an interface between the XPU (Extended Processing Unit) or extended processing unit and extraordinarily dense HBM chips. As a button shows: in a HBM3E stack the XPU and the HBM memory are linked through more than 1,000 drivers.
SK Hynix, Samsung and Micron are manufacturing on a large scale, although with different success12 -layer HBM3E memories. The two South Korean firms will produce large -scale HBM4 chips during the second semester of 2025, and Micron will do so in 2026. However, CXMT (Changxin Memory Technologies), one of the Chinese companies specialized in the production of memoirs, will launch Your first HBM3E chips in 2027.
SK Hynix leads the HBM memories market with a shocking authority. Your market share Broken 70%so that the remaining 30% are distributed by Samsung and Micron Technology. Behind them they step stronger and louder the Chinese chips manufacturers of Yangtze Memory Technologies Co. (YMTC) and CXMT, who have chosen to compete in this attractive market deploying a very aggressive price policy. CXMT in particular has increased its production capacity of DRAM chips almost five times during the last four years, which has allowed it to increase its global market share Until a very worthy 9%.
More information | SCMP
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