The SOC Kirin 9020 of Huawei demonstrates how much China has advanced with the chips. And also how much you have to do

Huawei and SMIC (Semiconductor manufacturing international corp) They go hand in hand in their adventure to sustain the Chinese semiconductor industry. The sanctions that The US government has deployed During the last two and a half years they seek to stop the development of Chinese companies that are dedicated to the design and manufacture of integrated circuits. The country’s semiconductor industry led by Xi Jinping brings together hundreds of companies, but these two are its spearhead. And they are because presumably are the ones that have the most resources at their disposal to innovate. And they are doing it. In fact, SMIC currently has the ability to manufacture Integrated 6 and 7 nm circuits. In addition, you are about to start 5 Nm chip production and plan to start Its first 3 nod nodes equipped with gaa transistors (Gate-alall-around) in 2026. It is not but that we are bad if we keep in mind that Chinese manufacturers do not have access to equipment extreme ultraviolet photolithography (UVE) of ASML, which are the ideal to produce these semiconductors. The Soc Kirin 9020 is a half success The launch of the new smartphones family Huawei pure 80 It invites us to take a look at your SOC to identify what it proposes and what integration technology is involved in its manufacture. This chip has been produced by SMIC in its 7 Nm node and class N+2. This terminology indicates that it is a 7 Nm and second generation lithograph Mate 60 Pro of Huawei. SMIC already has the ability to manufacture integrated circuits of 6 nm. And soon you can also produce 5 nm chips We have not yet had the opportunity to try any of the pure family 80 smartphones equipped with this SOC, but it is reasonable to anticipate that it will give users a satisfactory experience. Even so, it is evident that your performance by watt will not be comparable to that of The soc that manufactures TSMC in its nodes of 3 and 5 nm. As I mentioned a few lines above, SMIC already has the ability to manufacture integrated 6 NM circuits, and soon it can also produce 5 Nm semiconductors, but it is limited by the performance of the deep ultraviolet lithography equipment (UVP) you have in your possession. It is meritorious that SMIC and Huawei engineers have managed to refine their integrated circuit manufacturing processes what is necessary to produce chips of 5, 6 and 7 nm with the ASML UVP equipment, but a priori it is very unlikely that with these machines they will be able to go beyond the 3 Nm. And it is because the technique of Multiple patterningwhich is what they are using, imposes important limitations. A note: This strategy in broad strokes consists in transferring the pattern to the wafer in several passes with the purpose of increasing the resolution of the lithographic process. His problem is that he usually has an upward impact on the cost of chips and the decline in production capacity. For China it is a big problem not to have the necessary technology to produce avant -garde semiconductors comparable to those who manufacture Intel, AMD or Qualcomm, among other western alignment companies. The great hope of the country led by Xi Jinping is having as soon as possible Your own UVE photolithography teamsand it seems that they are close. In fact, A filtration has revealed that Huawei is already testing a prototype of one of these machines. If this information is finally confirmed and China has its commercial UVE machines in 2026 will have taken a crucial step in its pulse with the US. Image | Hiilicon In Xataka | Nvidia has to deal with the absolute distrust of several US legislators. His plan in China is in danger In Xataka | The US wants to end the chips for the Chinese that are sold abroad. And China knows how to defend oneself

Huawei will manufacture its Kirin X90 for PC using the 7 Nm of SMIC

Huawei and Smic work side by side and intensity since they get it The US sanctions to China. Together they have managed to manufacture 7 Nm semiconductoras, for example, the soc Kirin 9000s of the Mate 60 Prousing an integrated circuit production technique known as Multiple patterning. This strategy in broad strokes consists in transferring the pattern to the wafer in several passes with the purpose of increasing the resolution of the lithographic process. His problem is that he usually has an upward impact on the cost of chips and the decline in production capacity, although it works. These two Chinese companies have been forced to use the Multiple patterning in your teams of deep ultraviolet lithography (UVP) because the prohibitions of the United States and the Netherlands prevent the Dutch company Asml from selling their machine their machines in Chinese extreme ultraviolet photolithography (UVE). The latter allow to produce more advanced semiconductors than UVP equipment. Huawei and SMIC seem blocked in the 7 nm lithography A little over a year ago, in February 2024, the newspaper Financial Times said having had access to the statements of two experts who defended that SMIC was finalizing the refinement of their semiconductor manufacturing processes in their UVP machines. Its purpose, according to this source, was to have the necessary technology to manufacture Integrated 5 nm circuits Massively before the year 2024. For SMIC and its clients, among which Huawei is, this would be a very important achievement. The triple folding of Huawei, one of its most ambitious proposals, reuses a 7 nm soc However, Huawei’s 5 NM socates have not yet appeared. The chip Kirin 9010 which has happened to the 9000S model is also being manufactured in the 7 NM SMIC node using the technique of Multiple patterning. We can find this soc, for example, in Huawei’s new triple foldingthe mate ultimate design, which We have tried Just two weeks ago at the Mobile World Congress in Barcelona. It is evident that the last smartphones of this company would have been wonderful to have a 5 -nm Soc. And to his GPU Asce for artificial intelligence (AI) too. But there is even more. According to Digitimes Asiathe CPU for PC Kirin X90 that will produce Huawei with the purpose of consolidating an alternative to Intel and AMD chips will also be manufactured in the 7 Nm node. In these circumstances it is reasonable to conclude that, for the moment, Huawei and SMIC are stuck in this integration technology. This is a big problem for China because it does not have the necessary technology to produce avant -garde semiconductors comparable to those who manufacture Intel, AMD or Qualcomm, among other western alignment companies. The great hope of the country led by Xi Jinping is having as soon as possible Your own UVE photolithography teamsand it seems that they are close. In fact, as we tell you last week, A filtration has revealed that Huawei is already testing a prototype of one of these machines. If this information is finally confirmed and China has its commercial UVE machines in 2026 will have taken a crucial step in its pulse with the US. Image | Hiilicon More information | Digitimes Asia In Xataka | TSMC acknowledges that it has been considered taking its factories out of Taiwan. It is impossible for a good reason

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