USA says that Huawei will not be able to manufacture more than 200,000 AI chips in 2025. We know what the reason is

Jeffrey Kessler, Undersecretary of Commerce for Industry and Security of the US Department of Commerce, has done a few hours ago This statement in Congress: “Our evaluation indicates that the production capacity of Chips Ascend de Huawei by 2025 It will be 200,000 units or lessand we anticipate that the majority or all of that production will be delivered to companies within China. “

Besides, Kessler pointed out that “China is investing A lot of money to increase your chips production of artificial intelligence (AI), as well as the capabilities of the GPUs it produces. For this reason it is essential not to have a false sense of security and understand that China is reaching the US rapidly. “These statements express unambiguously how worried the US administration is in the development of China undergoing China in the field of AI.

China goes only between three and six months behind the US in AI

This is What David Sacks arguesan IA and cryptocurrency expert who exercises as an advisor to the Government of Donald Trump in this area. In addition, it acts as a link between the government and the American technology industry. The White House has clarified the statements of Sacks clarifying that this guru referred to AI models, so that Chinese chips are between one and two years behind their US equivalents.

Earlier this week Ren Zhengfei, the founder and general director of Huawei, declared that the GPU Ascend of this Chinese company are still A generation behind of the chips for the US. His reflection is aligned with what the US government defends, but it is important that we do not overlook that Huawei invests more than 25,000 million dollars annually in the development of its hardware for AI, so presumably it will not take long to match the benefits of the GPUs produced by NVIDIA or AMD.

In any case, the prediction of Jeffrey Kessler about the production capacity of avant -garde chips for Huawei is sustained on an irrefutable fact: the performance by wafer of the integration technologies used by the Chinese semiconductor manufacturer SMIC (Semiconductor manufacturing international corp) To produce the Huawei GPUs it has a very wide margin.

SMIC already has the ability to manufacture 6 Nm integrated circuits, and soon it can also produce 5 Nm semiconductors, but is limited by the performance of the deep ultraviolet lithography equipment (UVP) you have in your possession. It is meritorious that SMIC and Huawei engineers have managed to refine their integrated circuit manufacturing processes what is necessary to be able to produce 5, 6 and 7 nm chips With ASML UVP teams, but a priori it is very unlikely that with these machines they will be able to go beyond the 3 Nm.

And it is because the technique of Multiple patterningwhich is what they are using, imposes important limitations. A note: This strategy in broad strokes consists in transferring the pattern to the wafer in several passes with the purpose of increasing the resolution of the lithographic process. His problem is that he usually has an upward impact on the cost of chips and the decline in production capacity. For Huawei it is a big problem not to have the necessary technology to produce avant -garde semiconductors comparable to those who manufacture Intel, TSMC or Samsung, so it is working on the development of its own team of extreme ultraviolet photolithography (UVE).

More information | Reuters

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