He is already testing his 1.4 nm lithography and has announced when he will arrive

2025 will be the year in which the 2 Nm chips will take off. During the next months TSMC, Intel and Samsung will start large -scale production of this type of integrated circuits. However, each of these companies is found in a very different situation. The Taiwanese TSMC leads the market with a fee of approximately 60% and has closed A very successful 2024. In addition, Apple, Nvidia, AMD, Mediatek, Intel and Qualcomm have already officialized their intention to formalize orders for their 2 Nm integration technology.

Samsung’s starting point is less comfortable than TSMC’s. This South Korean company is reassessing your expansion plans and adjusting its template with the purpose of facing the future with the maximum possible guarantees. Of course, it is prepared to start large -scale production of 2 nm chips. Intel, meanwhile, is facing one of the most difficult stages Of all its history. Even so, Ben Sell, Vice President of Technology Development, confirmed At the end of last September that the 18A node already has the maturity necessary to enter large -scale production in 2025.

Integrated 1.4 NM circuits of TSMC will arrive in 2028

TSMC has confirmed that the tests of its 2 Nm node are being successful, so you can start large -scale manufacturing of semiconductors using this photolithography during the second semester of 2025. However, its medium -term plans do not end here. Just a few hours ago this company has held its Technological Conference of North America and has anticipated which is also testing its next avant -garde integration technology. It will call it A14 (1.4 Nm), will enter large -scale production in 2028 and we already know some of its most interesting characteristics.

One of its most important spots will consist that you will use transistors Nanosheet Gaa (Gate-alall-around) Second generation. The first generation will arrive next to the Lithography N2 (2 Nm) this year. In addition, this integration technology will land with the promise to make possible the manufacture of integrated circuits with higher performance, higher energy efficiency and a more flexible design. The usual. However, TSMC, fortunately, has been wet and in its event some figures have made public that allow us to assess to what extent the arrival of the A14 node will be important.

And, according to this company, the integrated circuits produced with the A14 lithography will be 15% faster than the chips manufactured in the NEN N2 with the same consumption; They will reduce energy expenditure by 30% at the same speed, and, in addition, they will put on the table the possibility of increasing the density of logic by 20%. According to Kevin ZhangSenior Vice President and Deputy Director of Operations of TSMC, the A14 node will be attractive to make chips for consumption devices and for strictly professional applications, such as, for example, GPU for artificial intelligence (AI).

As we have seen, TSMC hopes to start the large -scale manufacture of 1.4 Nm semiconductors in 2028, but at that time this integration technology will only have taken its first step. And it is likely that In 2029 a review of the lithography A14 is readyand presumably in 2030 the high performance and low cost versions of this node will arrive. This is the usual as long as TSMC sets a new integration technology. In fact, The nodes N4 nodes (4 NM), which is constituted by integration technologies N4, N4P and N4X, are improved Integration Technology N5 (5 Nm).

Images | TSMC

More information | TSMC

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